Chip cracks during assembly: Finding and eliminating the critical defect
Sauter, W., Kaldor, S., Clark, J., Laforte, S., McCarthy, C., Restaino, D., Casey, J., Questad, D.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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