In-situ Preclean Run Path Impact on Selective Cobalt Cap Deposition and Electromigration
Shoudy, Matthew, Shobha, Hosadurga, Huang, Huai, Nguyen, Son, Hu, Chao-Kun
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Published in 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.08.2020)
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Conference Proceeding
Ruthenium interconnect resistivity and reliability at 48 nm pitch
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Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
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Post porosity plasma protection integration at 48 nm pitch
Huai Huang, Lionti, Krystelle, Volksen, Willi, Spooner, Terry, Shobha, Hosadurga, Joe Lee, Chen, James Hsueh-Chung, Magbitang, Teddie, Peethala, Brown, Liniger, Eric G., Chao Kun Hu, Huang, Elbert, Canaperi, Donald F., Standaert, Theodorus E., Edelstein, Daniel C., Grill, Alfred, Dubois, Geraud, Bonilla, Griselda
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
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Copper contact metallization for 22 nm and beyond
Soon-Cheon Seo, Chih-Chao Yang, Chun-Chen Yeh, Haran, B., Horak, D., Fan, S., Koburger, C., Canaperi, D., Papa Rao, S.S., Monsieur, F., Knorr, A., Kerber, A., Chao-Kun Hu, Kelly, J., Tuan Vo, Cummings, J., Smalleya, M., Petrillo, K., Mehta, S., Schmitz, S., Levin, T., Dae-Guy Park, Stathis, J.H., Spooner, T., Paruchuri, V., Wynne, J., Edelstein, D., McHerron, D., Doris, B.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding
Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects
Nguyen, Son van, Priyadarshini, Deepika, Shobha, Hosadurga k, Haigh, Thomas J, Hu, Chao-kun, Cohen, Stephan A, Liniger, Eric, Shaw, Thomas M, Adams, Edward D, Burnham, Jay, Madan, Anita, Klymko, Nancy R, Parks, Christopher, Yang, Daewon, Molis, Steven E, Lin, Y, Bonilla, Griselda, Grill, Alfred, Edelstein, Daniel, Canaperi, Donald F, Xia, Li-Qun, Reiter, Steven, Balseanu, Mihaela, Shek, Mei-Yee
Published in ECS transactions (26.03.2014)
Published in ECS transactions (26.03.2014)
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Journal Article
A Novel Method to Fabricate CNT/Mg-6Zn Composites with High Strengthening Efficiency
Shi, Hailong, Wang, Xiaojun, Li, Chendong, Hu, Xiaoshi, Ding, Chao, Wu, Kun, Huang, Yudong
Published in Acta metallurgica sinica : English letters (01.10.2014)
Published in Acta metallurgica sinica : English letters (01.10.2014)
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Journal Article