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Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
Robust TSV via-middle and via-reveal process integration accomplished through characterization and management of sources of variation
Kumar, N., Ramaswami, S., Dukovic, J., Tseng, J., Ran Ding, Rajagopalan, N., Eaton, B., Mishra, R., Yalamanchili, R., Zhihong Wang, Xia, S., Sapre, K., Hua, J., Chan, A., Mori, G., Linke, B.
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Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Process Integration Considerations for 300 mm TSV Manufacturing
Ramaswami, S., Dukovic, J., Eaton, B., Pamarthy, S., Bhatnagar, A., Zhitao Cao, Sapre, K., Yuchun Wang, Kumar, A.
Published in IEEE transactions on device and materials reliability (01.12.2009)
Published in IEEE transactions on device and materials reliability (01.12.2009)
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