A new transferred ultra-thin silicon micropackaging
Chen, Jen-Yi, Huang, Long-Sun, Chu, Chia-Hua, Peizen, Chang
Published in Journal of micromechanics and microengineering (01.07.2002)
Published in Journal of micromechanics and microengineering (01.07.2002)
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Journal Article
Conference Proceeding
A 17.6-MHz 2.5V ultra-low polarization voltage MEMS oscillator using an innovative high gain-bandwidth fully differential trans-impedance voltage amplifier
Chen, Tung-Tsun, Huang, Jui-Cheng, Peng, Yung-Chow, Chu, Chia-Hua, Lin, Chung-Hsien, Cheng, Chun-Wen, Li, Cheng-Syun, Li, Sheng-Shian
Published in 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2013)
Published in 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2013)
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Conference Proceeding
Journal Article
Bulk-Si with poly bump process scheme for MEMS sensors
Chun-Wen Cheng, Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin, Hsiao Chin Tuan, Kalnitsky, A., Weileun Fang, Horsley, D. A.
Published in 2012 IEEE Sensors (01.10.2012)
Published in 2012 IEEE Sensors (01.10.2012)
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Conference Proceeding
A new integration of device-scale micropackaging with bi-directional tunable capacitors
Chia-Hua Chu, Long-Sun Huang, Jen-Yi Chen, I-Lien Lee, Peizen Chang
Published in The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE (2003)
Published in The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE (2003)
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Conference Proceeding