Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid
Guedon, Arsene, Bouguerra, Nizar, Paradis, Etienne, Duchesne, Eric, Allard, Stephanie, Fremont, Helene, Drouin, Dominique
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Effect of squeezing conditions on the particle distribution and bond line thickness of particle filled polymeric thermal interface materials
Shirazy, Mahmood R. S., Allard, Stephanie, Beaumier, Martin, Frechette, Luc G.
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
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Conference Proceeding
Problems with wirebonding on probe marks and possible solutions
Sauter, W., Aoki, T., Hisada, T., Miyai, H., Petrarea, K., Beaulied, F., Allard, S., Power, J., Agbesi, M.
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding
Manufacturability and reliability of different size wirebonds on different Al pad structures
Sauter, W., Aoki, T., Hisada, T., Beaulieu, F., Allard, S., Ostrowski, K.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding