Structuring Collaborative Business Intelligence: A Literature Review
Kaufmann, Jens, Chamoni, Peter
Published in 2014 47th Hawaii International Conference on System Sciences (01.01.2014)
Published in 2014 47th Hawaii International Conference on System Sciences (01.01.2014)
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Conference Proceeding
Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation
Hughes, Michael, Strussevitch, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David, Desmulliez, Marc P. Y.
Published in International journal for numerical methods in fluids (30.09.2010)
Published in International journal for numerical methods in fluids (30.09.2010)
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Journal Article
Vorschlag eines morphologischen Kastens zur Charakterisierung von Data-Science-Projekten
Theuerkauf, René, Daurer, Stephan, Hoseini, Sayed, Kaufmann, Jens, Kühnel, Stephan, Schwade, Florian, Alekozai, Emal M., Neuhaus, Uwe, Rohde, Heiko, Schulz, Michael
Published in Informatik-Spektrum (01.12.2022)
Published in Informatik-Spektrum (01.12.2022)
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Journal Article
Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias
Kaufmann, J., Desmulliez, M.P.Y., Price, D., Hughes, M., Strussevich, N., Bailey, C.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Megasonic enhanced wafer bumping process to enable high density electronics interconnection
Yingtao Tian, Kaufrnann, J., Changqing Liu, Hutt, D.A., Stevens, B., Desmulliez, M.P.Y.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding