Ultra-thin flexible microcircuit assemblies using thinned die and multilayer thin-film substrates
Francomacaro, A.S., Charles, H.K., Lehtonen, S.J., Keeney, A.C., Clatterbaugh, G.V., Banda, C.V.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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