Empirical modeling and response surfaces for electroless Co deposition process
PAUNOVIC, M, TRANG NGUYEN, MUKHERJEE, R, SAMBUCETTI, C, ROMANKIW, L. T
Published in Journal of the Electrochemical Society (01.05.1995)
Published in Journal of the Electrochemical Society (01.05.1995)
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Journal Article
Reduced electromigration and stressed induced migration of copper wires by surface coating
STAMPER ANTHONY K, HU CHAO-KUN, SAMBUCETTI CARLOS J, RUBINO JUDITH M, ROSENBERG ROBERT
Year of Publication 23.12.2008
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Year of Publication 23.12.2008
Patent
Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures
CHIRAS STEFANIE RUTH, ROSENBERG ROBERT, LANE MICHAEL WAYNE, MC FEELY FENTON REED, SAMBUCETTI CARLOS JUAN, MALHOTRA SANDRA GUY, VEREECKEN PHILIPPE MARK
Year of Publication 02.11.2010
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Year of Publication 02.11.2010
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Self-aligned corrosion stop for copper C4 and wirebond
STAMPER ANTHONY K, SAMBUCETTI CARLOS J, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 25.07.2006
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Year of Publication 25.07.2006
Patent
Reduced electromigration and stressed induced migration of copper wires by surface coating
STAMPER ANTHONY K, HU CHAO-KUN, SAMBUCETTI CARLOS J, RUBINO JUDITH M, ROSENBERG ROBERT
Year of Publication 01.12.2005
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Year of Publication 01.12.2005
Patent
Self-aligned corrosion stop for copper C4 and wirebond
STAMPER ANTHONY K, SAMBUCETTI CARLOS J, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 25.11.2004
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Year of Publication 25.11.2004
Patent