FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays
Lee, Taemin, Jung, Joontaek, Lee, Sang-Mok, Park, Jongcheol, Park, Jae-Hyeong, Paik, Kyung-Wook, Lee, Hyunjoo J.
Published in Sensors (Basel, Switzerland) (25.07.2022)
Published in Sensors (Basel, Switzerland) (25.07.2022)
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Journal Article
IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints
Ren, Ning, Fang, Heng, Wang, Dong, Hou, Chenyi, Zhao, Yatao, Chen, Fan, Tian, Ye, Paik, Kyung-Wook, Wu, Yiping
Published in Materials (06.01.2020)
Published in Materials (06.01.2020)
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Journal Article
Equilibrium phase diagram design and structural optimization of SAC/Sn-Pb composite structure solder joint for preferable stress distribution
Xu, Sunwu, Jing, Xinyi, Zhu, Pengyu, Jin, Haoran, Paik, Kyung-Wook, He, Peng, Zhang, Shuye
Published in Materials characterization (01.12.2023)
Published in Materials characterization (01.12.2023)
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Journal Article
Preparation and characterization of Sn-3.0Ag-0.5Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating
Zhang, Shuai, Zhang, Shuye, Zhou, Hongzhi, Paik, Kyung-Wook, Ding, Tianran, Long, Weimin, Zhong, Sujuan, He, Peng
Published in Materials characterization (01.01.2024)
Published in Materials characterization (01.01.2024)
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Journal Article
Preparation, characterization and mechanical properties analysis of SAC305-SnBi-Co hybrid solder joints for package-on-package technology
Zhang, Shuai, Jing, Xinyi, Chen, Jieshi, Paik, Kyung-Wook, He, Peng, Zhang, Shuye
Published in Materials characterization (01.02.2024)
Published in Materials characterization (01.02.2024)
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Journal Article
Thermally resistant UV-curable epoxy–siloxane hybrid materials for light emitting diode (LED) encapsulation
Yang, SeungCheol, Kwak, Seung-Yeon, Jin, JungHo, Kim, Joon-Soo, Choi, Yongwon, Paik, Kyung-Wook, Bae, Byeong-Soo
Published in Journal of materials chemistry (01.01.2012)
Published in Journal of materials chemistry (01.01.2012)
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Journal Article
Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake
Kim, Jin, Kim, Jungmo, Song, Sungho, Zhang, Shuye, Cha, Jaemin, Kim, Kisun, Yoon, Hyewon, Jung, Yeonwoong, Paik, Kyung-Wook, Jeon, Seokwoo
Published in Carbon (New York) (01.03.2017)
Published in Carbon (New York) (01.03.2017)
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Journal Article
Effect of co on the morphology and mechanical properties of the Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joints on ENEPIG surface
Zhang, Shuai, Jing, Xinyi, Zhang, Shang, Chen, Jieshi, Paik, Kyung-Wook, He, Peng, Zhang, Shuye
Published in Materials characterization (01.03.2024)
Published in Materials characterization (01.03.2024)
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Journal Article
Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking
Tian, Ye, Fang, Heng, Ren, Ning, Zhao, Yatao, Chen, Boli, Wu, Fengshun, Paik, Kyung-Wook
Published in Journal of alloys and compounds (05.07.2020)
Published in Journal of alloys and compounds (05.07.2020)
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Journal Article
Hybrid ultrasound prove array and method of manufacturing the same
PARK JONG CHEOL, LEE SANG MOK, PARK JAE HYEONG, PAIK KYUNG WOOK, LEE JONG KWON, LEE HYUN JOO
Year of Publication 08.07.2021
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Year of Publication 08.07.2021
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