Search Results - "Mao, Wei-Jhih" :: K.UTB vyhledávací portál

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Low temperature preparation of ITO thin films by the coating solutions containing solvothermally synthesized ITO nanoparticles

by LU, Hsin-Chun, MAO, Jhih-Wei, CHIANG, Yun-Chih
Published in Surface & coatings technology (01.09.2013)

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Conference Proceeding Journal Article

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WIRE-BOND DAMPER FOR SHOCK ABSORPTION

by CHANG KUEI SUNG, MAO WEI JHIH, TSAI SHANG YING, CHENG CHUN WEN, HSIEH TSUNG LIN
Year of Publication 19.07.2024

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Patent

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WIRE-BOND DAMPER FOR SHOCK ABSORPTION

by CHANG KUEI SUNG, MAO WEI JHIH, TSAI SHANG YING, CHENG CHUN WEN, HSIEH TSUNG LIN
Year of Publication 14.07.2023

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Patent

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MEMS COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A MEMS DEVICE

by CHANG KUEI SUNG, MAO WEI JHIH, TSAI SHANG YING
Year of Publication 05.10.2021

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Patent

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WIRE-BOND DAMPER FOR SHOCK ABSORPTION

by CHANG KUEI SUNG, MAO WEI JHIH, TSAI SHANG YING, CHENG CHUN WEN, HSIEH TSUNG LIN
Year of Publication 31.05.2022

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Patent

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COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A MEMS DEVICE

by Mao, Wei-Jhih, Chang, Kuei-Sung, Tsai, Shang-Ying
Year of Publication 15.08.2024

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Patent

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Composite spring structure to reinforce mechanical robustness of a MEMS device

by Mao, Wei-Jhih, Chang, Kuei-Sung, Tsai, Shang-Ying
Year of Publication 28.05.2024

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Patent

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DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

by Mao, Wei-Jhih, Chang, Kuei-Sung, Tsai, Shang-Ying
Year of Publication 16.05.2024

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Patent

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Die attached leveling control by metal stopper bumps

by Mao, Wei-Jhih, Chang, Kuei-Sung, Tsai, Shang-Ying
Year of Publication 05.03.2024

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Patent

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DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

by Mao, Wei-Jhih, Chang, Kuei-Sung, Tsai, Shang-Ying
Year of Publication 18.01.2024

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Patent

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COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A MEMS DEVICE

by Mao, Wei-Jhih, Chang, Kuei-Sung, Tsai, Shang-Ying
Year of Publication 29.09.2022

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Patent

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Wire-bond damper for shock absorption

by Mao, Wei-Jhih, Chang, Kuei-Sung, Hsieh, Tsung-Lin, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 21.05.2024

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Patent

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DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

by Mao, Wei-Jhih, Chang, Kuei-Sung, Tsai, Shang-Ying
Year of Publication 25.08.2022

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Patent

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Composite spring structure to reinforce mechanical robustness of a MEMS device

by Mao, Wei-Jhih, Chang, Kuei-Sung, Tsai, Shang-Ying
Year of Publication 23.08.2022

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Patent

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WIRE-BOND DAMPER FOR SHOCK ABSORPTION

by Mao, Wei-Jhih, Chang, Kuei-Sung, Hsieh, Tsung-Lin, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 30.11.2023

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Patent

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STOPPER BUMP STRUCTURES FOR MEMS DEVICE

by Mao, Wei-Jhih, Chang, Kuei-Sung, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 17.08.2023

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Patent

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COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A MEMS DEVICE

by Mao, Wei-Jhih, Chang, Kuei-Sung, Tsai, Shang-Ying
Year of Publication 23.09.2021

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Patent

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Semiconductor structure and manufacturing method thereof

by Mao, Wei-Jhih, Chang, Kuei-Sung, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 30.05.2023

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Patent

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WIRE-BOND DAMPER FOR SHOCK ABSORPTION

by Mao, Wei-Jhih, Chang, Kuei-Sung, Hsieh, Tsung-Lin, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 26.05.2022

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Patent

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SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

by TSAI, SHANG-YING, CHANG, KUEI-SUNG, MAO, WEI-JHIH, CHENG, CHUN-WEN
Year of Publication 14.04.2022

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Patent

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