Search Results - "KO, Ji-Han" :: K.UTB vyhledávací portál

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Carrier substrate and packaging method using the same

by Kim, Wonkeun, Ko, Ji-Han
Year of Publication 28.12.2021

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Printed circuit boards with anti-warping molding portions and related semiconductor packages and methods of fabricating

by Kang, Bo Ram, Kim, Dong Kwan, Ko, Ji-Han
Year of Publication 24.11.2020

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PRINTED CIRCUIT BOARDS WITH ANTI-WARPING MOLDING PORTIONS AND RELATED SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING

by Kang, Bo Ram, Kim, Dong Kwan, Ko, Ji-Han
Year of Publication 25.04.2019

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Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics

by Jin, Hwa-il, Hyung, Su-jung, Ko, Ji-han, Kim, Yeong-seok, Lee, Joung-phil, Kim, Won-keun, Oh, Kyung-suk, Kim, Kil-soo
Year of Publication 21.12.2021

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Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics

by Jin, Hwa-il, Hyung, Su-jung, Ko, Ji-han, Kim, Yeong-seok, Lee, Joung-phil, Kim, Won-keun, Oh, Kyung-suk, Kim, Kil-soo
Year of Publication 06.10.2020

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Semiconductor Packages Having Improved Thermal Discharge And Electromagnetic Shielding Characteristics

by Joung-phil Lee, Su-jung Hyung, Yeong-seok Kim, Kyung-suk Oh, Ji-han Ko, Hwa-il Jin, Won-keun Kim, Kil-soo Kim
Year of Publication 29.04.2020

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SEMICONDUCTOR PACKAGES HAVING IMPROVED THERMAL DISCHARGE AND ELECTROMAGNETIC SHIELDING CHARACTERISTICS

by Jin, Hwa-il, Hyung, Su-jung, Ko, Ji-han, Kim, Yeong-seok, Lee, Joung-phil, Oh, Kyung-suk, KIM, Won-keun, Kim, Kil-soo
Year of Publication 05.03.2020

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LEITERPLATTEN MIT VERKRÜMMUNGSFESTEN FORMTEILABSCHNITTEN UND ZUGEHÖRIGE HALBLEITERPACKAGES UND HERSTELLUNGSVERFAHREN

by Kang, Bo Ram, Kim, Dong Kwan, Ko, Ji-Han
Year of Publication 25.04.2019

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SEMICONDUCTOR PACKAGE

by KO, Ji-Han, JIN, Hwail
Year of Publication 06.04.2023

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CARRIER SUBSTRATE AND PACKAGING METHOD USING THE SAME

by KO, Ji-Han, KIM, Wonkeun
Year of Publication 30.04.2020

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SEMICONDUCTOR PACKAGES HAVING IMPROVED THERMAL DISCHARGE AND ELECTROMAGNETIC SHIELDING CHARACTERISTICS

by LEE, Joung-phil, HYUNG, Su-jung, KIM, Kil-soo, KO, Ji-han, JIN, Hwa-il, KIM, Won-keun, OH, Kyung-suk, KIM, Yeong-seok
Year of Publication 24.12.2020

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SEMICONDUCTOR PACKAGES HAVING IMPROVED THERMAL DISCHARGE AND ELECTROMAGNETIC SHIELDING CHARACTERISTICS

by LEE, Joung-phil, HYUNG, Su-jung, KO, Ji-han, JIN, Hwa-il, KIM, Won-keun, Kim, Kil-soo, OH, Kyung-suk, KIM, Yeong-seok
Year of Publication 25.03.2020

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Semiconductor package

by JIN HWA-IL, KO JI-HAN
Year of Publication 11.04.2023

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CARRIER SUBSTRATE AND PACKAGING METHOD USING THE SAME

by KIM WONKEUN, KO JI-HAN
Year of Publication 01.05.2020

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Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics

by KO, JI-HAN, KIM, KIL-SOO, OH, KYUNG-SUK, LEE, JOUNG-PHIL, KIM, YEONG-SEOK, KIM, WON-KEUN, JIN, HWA-IL, HYUNG, SU-JUNG
Year of Publication 21.04.2023

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Printed circuit board, semiconductor package and method for fabricating semiconductor package

by KANG BO-RAM, KO JI-HAN, KIM DONG-KWAN
Year of Publication 30.04.2019

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Chip-stacked semiconductor package

by KO JI-HAN
Year of Publication 09.01.2013

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Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics

by KO, JI-HAN, KIM, KIL-SOO, OH, KYUNG-SUK, LEE, JOUNG-PHIL, KIM, YEONG-SEOK, KIM, WON-KEUN, JIN, HWA-IL, HYUNG, SU-JUNG
Year of Publication 16.03.2020

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