SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
JOSHI, RAJEEV, D, LEE BUYONG-OK, KENG, TAN TEIK, WU, CHUNG-LIN, CHOI, YOONHWA, GOOI, BOON HUAN, LIM, LAY YEAP, IYER, VENKAT, NAM, SHIBACK, CHONG, DAVID, JEON , OSEOB, ESTACIO, MARIA CRISTINA B
Year of Publication 25.11.2020
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Year of Publication 25.11.2020
Patent