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Search Results - "HUANG, TIENUNG"
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"HUANG, TIENUNG"
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Voice coil motor type focusing actuator
by
HUANG TIENUNG
Year of Publication
31.07.2012
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Camera shutter
by
HUANG TIENUNG
Year of Publication
20.03.2012
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Camera shutter
by
HUANG TIENUNG
Year of Publication
13.03.2012
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Camera shutter
by
HUANG TIENUNG
Year of Publication
24.03.2011
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Camera shutter
by
HUANG TIENUNG
Year of Publication
24.03.2011
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Voice coil motor type focusing actuator
by
HUANG TIENUNG
Year of Publication
22.02.2011
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VOICE COIL MOTOR TYPE FOCUSING ACTUATOR
by
HUANG TIENUNG
Year of Publication
17.02.2011
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Air pump with improved air intake control structure
by
HUANG TIENUNG
Year of Publication
26.10.2010
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Step motor for a driving mechanism of camera
by
HUANG TIENUNG
Year of Publication
29.12.2009
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Method for manufacturing transparent polyamide copolymer
by
CHOU, HUNG-KEN
,
LIN, CHI-NENG
,
HUANG
,
TIENUNG
Year of Publication
16.06.2022
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High thermal conductivity polyamide copolymer and method for preparing the same
by
CHOU, HUNG-KEN
,
LIN, CHI-NENG
,
HUANG
,
TIENUNG
Year of Publication
01.05.2022
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HIGH THERMAL CONDUCTIVITY POLYAMIDE COPOLYMER AND METHOD FOR PREPARING THE SAME
by
CHOU, HUNG-KEN
,
LIN, CHI-NENG
,
HUANG
,
TIENUNG
Year of Publication
01.11.2021
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METHOD FOR MANUFACTURING TRANSPARENT POLYAMIDE COPOLYMER
by
CHOU, HUNG-KEN
,
LIN, CHI-NENG
,
HUANG
,
TIENUNG
Year of Publication
21.10.2021
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Diamine compound, copolymer, and method for manufacturing the same
by
CHOU, HUNG-KEN
,
WU, CHING
,
LIN, CHI-NENG
,
HUANG
,
TIENUNG
Year of Publication
01.11.2022
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Diamine compound, copolymer, and method for manufacturing the same
by
CHOU, HUNG-KEN
,
WU, CHING
,
LIN, CHI-NENG
,
HUANG
,
TIENUNG
Year of Publication
16.03.2022
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Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package
by
HSU TSUNG-HSIEN
,
CHUNG KUANG-NENG
,
HUANG TIENUNG
,
CHUNG HSIN-LUNG
Year of Publication
09.02.2016
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SHIELD, PACKAGE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SHIELD AND FABRICATION METHOD OF THE SEMICONDUCTOR PACKAGE
by
HSU TSUNG-HSIEN
,
CHUNG KUANG-NENG
,
HUANG TIENUNG
,
CHUNG HSIN-LUNG
Year of Publication
23.10.2014
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Semiconductor package and method of manufacture the same, shielding mask and package structure having the mask
by
HSU, TSUNG-HSIEN
,
CHUNG, HSIN-LUNG
,
CHUNG, KUANG-NENG
,
HUANG
,
TIENUNG
Year of Publication
01.11.2014
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Shield, Package Structure And Semiconductor Package Having The Shield And Fabrication Method Of The Semiconductor Package
by
HSU TSUNG-HSIE
,
CHUNG KUANG-NENG
,
HUANG TIENUNG
,
CHUNG HSIN-LUNG
Year of Publication
22.10.2014
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Clamp device for use in sputtering process of wafer fabrication, and method of sputtering and electroplating semiconductor package
by
HSU, TSUNG-HSIEN
,
CHIEN, CHUNONG
,
LAI, WEN-TE
,
CHANG, CHO-HSING
,
HUANG
,
TIENUNG
Year of Publication
16.05.2014
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