56 nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme
LOQUET, Yannick, MIGNOT, Yann, MORRIS, Bryan, KLEEMEIER, Walter, LINIGER, E, SPOONER, Terry, WASKIEWICZ, Christopher, CHEN, James Hsueh-Chung, SANKARAPANDIAN, Muthumanickam, CHEN, Shyng-Tsong, FLAITZ, Philip, TOMIZAWA, Hideyuki, TSENG, Chia-Hsun, BEARD, Marcy
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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