Modelling of keyhole dynamics and porosity formation considering the adaptive keyhole shape and three-phase coupling during deep-penetration laser welding
Zhao, Haiyan, Niu, Wenchong, Zhang, Bin, Lei, Yongping, Kodama, Masaru, Ishide, Takashi
Published in Journal of physics. D, Applied physics (07.12.2011)
Published in Journal of physics. D, Applied physics (07.12.2011)
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Journal Article
Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder
Shi, Yaowu, Tian, Jun, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of alloys and compounds (03.04.2008)
Published in Journal of alloys and compounds (03.04.2008)
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Journal Article
Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy
Dong, Wenxing, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of electronic materials (01.07.2008)
Published in Journal of electronic materials (01.07.2008)
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Journal Article
Correlation Between Tensile Strength and Hardness of Electron Beam Welded TC4-DT Joints
Lu, Wei, Shi, Yaowu, Li, Xiaoyan, Lei, Yongping
Published in Journal of materials engineering and performance (01.06.2013)
Published in Journal of materials engineering and performance (01.06.2013)
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Journal Article
Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder
Li, Guangdong, Shi, Yaowu, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of alloys and compounds (18.02.2010)
Published in Journal of alloys and compounds (18.02.2010)
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Journal Article
Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach
Xu, Guangchen, Guo, Fu, Wang, Xitao, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan
Published in Journal of alloys and compounds (21.01.2011)
Published in Journal of alloys and compounds (21.01.2011)
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Journal Article
Microstructure and Properties of Cast B-Bearing High Speed Steel
Fu, Hanguang, Ma, Shengqiang, Hou, Jianqiang, Lei, Yongping, Xing, Jiandong
Published in Journal of materials engineering and performance (01.04.2013)
Published in Journal of materials engineering and performance (01.04.2013)
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Journal Article
Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint
Xiao, WeiMin, Shi, YaoWu, Xu, GuangChen, Ren, Ren, Guo, Fu, Xia, ZhiDong, Lei, YongPing
Published in Journal of alloys and compounds (20.03.2009)
Published in Journal of alloys and compounds (20.03.2009)
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Journal Article
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging
Hao, Hu, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of electronic materials (2008)
Published in Journal of electronic materials (2008)
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Journal Article
Conference Proceeding
Creep property of composite solders reinforced by nano-sized particles
Shi, Yaowu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.04.2008)
Published in Journal of materials science. Materials in electronics (01.04.2008)
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Journal Article
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles
Shi, Yaowu, Liu, Jianping, Yan, Yanfu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.04.2008)
Published in Journal of electronic materials (01.04.2008)
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Journal Article
Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints
Li, Guangdong, Shi, Yaowu, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.02.2009)
Published in Journal of materials science. Materials in electronics (01.02.2009)
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Journal Article
Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration
Guo, Fu, Xu, Guangchen, Sun, Jia, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan
Published in Journal of electronic materials (01.12.2009)
Published in Journal of electronic materials (01.12.2009)
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Journal Article
Conference Proceeding
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test
Zhang, Ning, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.10.2008)
Published in Journal of electronic materials (01.10.2008)
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Journal Article
Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints
Dong, Wenxing, Shi, Yaowu, Lei, Yongping, Xia, Zhidong, Guo, Fu
Published in Journal of electronic materials (01.09.2009)
Published in Journal of electronic materials (01.09.2009)
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Journal Article
Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles
Shi, Yaowu, Yan, Yanfu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.09.2009)
Published in Journal of electronic materials (01.09.2009)
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Journal Article