Interfacial reaction studies on lead (Pb)-free solder alloys
Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Myung-Jin Yim, Advocate, G.G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T.A., King, D.E., Konrad, J.J., Sarkhel, A., Puttlitz, K.J.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
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Journal Article
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
Kang, S.K., Lauro, P., Da-Yuan Shih, Henderson, D.W., Gosselin, T., Bartelo, J., Cain, S.R., Goldsmith, C., Puttlitz, K.J., Tae-Kyung Hwang
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding