A wafer-scale 3-D circuit integration technology
Burns, J.A., Aull, B.F., Chen, C.K., Chang-Lee Chen, Keast, C.L., Knecht, J.M., Suntharalingam, V., Warner, K., Wyatt, P.W., Yost, D.-R.W.
Published in IEEE transactions on electron devices (01.10.2006)
Published in IEEE transactions on electron devices (01.10.2006)
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