Electroplating device and electroplating method for electronic packaging
YU CHENWEI, CHEN HUASAN, WANG LYUHUA, YANG LEI, ZHAO FEI, ZHANG YUJUN
Year of Publication 01.09.2023
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Year of Publication 01.09.2023
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Heterogeneous layered composite sealing cover and processing method thereof
HUANG ZHIGANG, YU CHENWEI, WANG LYUHUA, HE SUZHEN, ZHAO FEI, ZHANG YUJUN
Year of Publication 03.02.2023
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Year of Publication 03.02.2023
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