Electronic package structure with offset stacked chips and top and bottom side cooling lid
Sikka, Kamal K, Bonam, Ravi K, Li, Shidong, Sakuma, Katsuyuki, Toy, Hilton T
Year of Publication 30.01.2024
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Year of Publication 30.01.2024
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Electronic Package Structure With Offset Stacked Chips And Top And Bottom Side Cooling Lid
Sikka, Kamal K, Bonam, Ravi K, Li, Shidong, Sakuma, Katsuyuki, Toy, Hilton T
Year of Publication 22.06.2023
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Year of Publication 22.06.2023
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Mitigating cooldown peeling stress during chip package assembly
Tunga, Krishna R, Farooq, Mukta Ghate, Sakuma, Katsuyuki, Toy, Hilton T
Year of Publication 03.01.2023
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Year of Publication 03.01.2023
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Lid/heat spreader having targeted flexibility
Li, Shidong, Bunt, Jay A, Toy, Hilton, Zhang, Hongqing, Lewison, David J, Marston, Kenneth C
Year of Publication 30.08.2022
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Year of Publication 30.08.2022
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MITIGATING COOLDOWN PEELING STRESS DURING CHIP PACKAGE ASSEMBLY
Tunga, Krishna R, Farooq, Mukta Ghate, Sakuma, Katsuyuki, Toy, Hilton T
Year of Publication 30.06.2022
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Year of Publication 30.06.2022
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Laminated stiffener to control the warpage of electronic chip carriers
Sikka, Kamal K, Iruvanti, Sushumna, Tunga, Krishna R, Li, Shidong, Weiss, Thomas, Toy, Hilton T
Year of Publication 12.04.2022
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Year of Publication 12.04.2022
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Pluggable LGA socket for high density interconnects
Benner, Alan F, Fasano, Benjamin Vito, Toy, Hilton T, Fortier, Paul Francis
Year of Publication 12.10.2021
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Year of Publication 12.10.2021
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LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY
BUNT, JAY A, TOY, HILTON, ZHANG, HONGQING, MARSTON, KENNETH C, LI, SHIDONG, LEWISON, DAVID J
Year of Publication 29.07.2021
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Year of Publication 29.07.2021
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Multi integrated circuit chip carrier package
Sikka, Kamal K, Interrante, Marcus E, Sinha, Tuhin, Zitz, Jeffrey A, Toy, Hilton T, Lange, Kathryn R
Year of Publication 13.04.2021
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Year of Publication 13.04.2021
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Method of forming an electronic package
Sikka, Kamal K, Iruvanti, Sushumna, Tunga, Krishna R, Li, Shidong, Weiss, Thomas, Toy, Hilton T
Year of Publication 28.04.2020
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Year of Publication 28.04.2020
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Lid attach optimization to limit electronic package warpage
Sikka, Kamal K, Iruvanti, Sushumna, Li, Shidong, Zitz, Jeffrey A, Toy, Hilton T
Year of Publication 17.03.2020
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Year of Publication 17.03.2020
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Cooling structure for electronic boards
Sikka, Kamal K, Werner, Randall J, Bodenweber, Paul F, Zitz, Jeffrey A, Toy, Hilton T, Marston, Kenneth C
Year of Publication 26.01.2021
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Year of Publication 26.01.2021
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LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
Sikka, Kamal K, Iruvanti, Sushumna, Tunga, Krishna R, Li, Shidong, Weiss, Thomas, Toy, Hilton T
Year of Publication 09.01.2020
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Year of Publication 09.01.2020
Patent
Cooling structure for electronic boards
Sikka, Kamal K, Werner, Randall J, Bodenweber, Paul F, Zitz, Jeffrey A, Toy, Hilton T, Marston, Kenneth C
Year of Publication 25.08.2020
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Year of Publication 25.08.2020
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Lid attach optimization to limit electronic package warpage
Sikka, Kamal K, Iruvanti, Sushumna, Li, Shidong, Zitz, Jeffrey A, Toy, Hilton T
Year of Publication 25.06.2019
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Year of Publication 25.06.2019
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Multi Integrated Circuit Chip Carrier Package
Sikka, Kamal K, Interrante, Marcus E, Sinha, Tuhin, Zitz, Jeffrey A, Toy, Hilton T, Lange, Kathryn R
Year of Publication 30.04.2020
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Year of Publication 30.04.2020
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