Search Results - "LIN LIANGN" :: K.UTB vyhledávací portál

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Semiconductor device and method for making of same

by LIN, LIANGN
Year of Publication 11.12.2022

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Patent

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Semiconductor device and method for making of same

by LIN, LIANGN
Year of Publication 01.10.2022

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Patent

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Interposer circuit, CoWoS circuit, and method of using interposer circuit

by CHANG, SHIHNG, LIN, LIANGN
Year of Publication 01.07.2020

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Patent

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Interposer circuit, substrate-on-wafer circuit and method for utilizing interface circuit

by LIN LIANGN, CHANG SHIHNG
Year of Publication 08.05.2020

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Patent

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Bump-on-trace structures with increased current entrance areas

by LIN LIANGN, HOU FU-TSAI
Year of Publication 18.02.2015

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Patent

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Bump-on-trace structures with wide and narrow portions

by LIN LIANGN, HOU FU-TSAI
Year of Publication 14.05.2013

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Patent

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Display and grid driver thereof

by LIN LIANGN, HUANG KUANUN, LEI CHEN-YUAN, YEH PIUN
Year of Publication 06.05.2015

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Patent

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Bump-on-Trace Structures with Increased Current Entrance Areas

by LIN LIANGN, HOU FU-TSAI
Year of Publication 03.01.2013

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Patent

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Display and gate driver thereof

by LIN LIANGN, HUANG KUANUN, LEI CHEN-YUAN, YEH PIUN
Year of Publication 10.02.2015

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Patent

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Display and Gate Driver thereof

by LIN LIANGN, HUANG KUANUN, LEI CHEN-YUAN, YEH PIUN
Year of Publication 06.02.2014

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Patent

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Bonding and probing pad structures

by LIN LIANGN, TSAO PEI-HAW
Year of Publication 08.07.2008

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Patent

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NOVEL BONDING AND PROBING PAD STRUCTURES

by LIN LIANGN, TSAO PEI-HAW
Year of Publication 10.04.2008

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Patent

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SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

by LIN LIANGN, WU TUNG-JIUN, LU GIA-HER, YEH TUNGIN, WU JYUN-LIN
Year of Publication 24.03.2016

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Patent

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Semiconductor package and manufacturing process thereof

by HSIEH, TSUNG-YANG, TSAI, KUEN-HONG, LIN, LIANGN, CHEN, HSU-HSIEN, LEE, HSIN-HSIEN, CHU, LI-HUAN
Year of Publication 01.05.2021

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Patent

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SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS THEREOF

by HSIEH, TSUNG-YANG, TSAI, KUEN-HONG, LIN, LIANGN, CHEN, HSU-HSIEN, LEE, HSIN-HSIEN, CHU, LI-HUAN
Year of Publication 01.03.2021

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Patent

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TEST CHIP, TEST BOARD AND RELIABILITY TESTING METHOD

by SU SHIANG-RUEI, LIN LIANGN, TU CHIA-WEI
Year of Publication 05.09.2013

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Patent

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Flip chip packages with spacers separating heat sinks and substrates

by LIN LIANGN, TSAO PEI-HAW, NIU PAO-KANG
Year of Publication 30.11.2010

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Patent

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Methods for forming stacked capacitors with fuse protection

by LIN LIANGN, HU HSIEN-PIN, LU GIA-HER, LIN SHIH-KAI, CHANG SHIHNG, YEH TUNGIN, WU JYUN-LIN, HOU FU-TSAI
Year of Publication 05.07.2016

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Patent

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System-in-package packaging for minimizing bond wire contamination and yield loss

by LIU I-TAI, LIN LIANGN, TSAO PEI-HAW, KIANG BILL, NIU PAO-KANG
Year of Publication 10.07.2012

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Patent

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Capacitor with Fuse Protection

by LIN LIANGN, HU HSIEN-PIN, LU GIA-HER, LIN SHIH-KAI, CHANG SHIHNG, YEH TUNGIN, WU JYUN-LIN, HOU FU-TSAI
Year of Publication 30.07.2015

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Patent

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