Search Results - "LEI YONGPING" :: K.UTB vyhledávací portál

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Device for preparing micro solder balls for chip scale packaging through electromagnetic disturbance and flow focusing

by LEI YONGPING, WANG TONGJU
Year of Publication 25.06.2021

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Flexible sewage cut-off device

by LEI YONGPING, TU GUOSHENG
Year of Publication 12.07.2024

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Composite additive for improving stability of lead-free solder paste and preparation method of corresponding lead-free solder paste

by ZHANG WENQIAN, LEI YONGPING, WANG TONGJU
Year of Publication 08.12.2023

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High-precision metering method and device for fluid

by CHENG HUANG, LEI YONGPING, CHEN LIFENG, LI LEI
Year of Publication 17.05.2024

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Micro solder ball shape parameter detection device and method based on machine vision

by ZHANG WENQIAN, LIU YAHAO, LEI YONGPING, WANG TONGJU
Year of Publication 24.11.2023

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Ice and snow melting device and method

by CHEN WEI, LEI YONGPING
Year of Publication 19.10.2018

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Natural gas pressurizing mechanism

by LEI YONGPING, CUI JIANYANG, WANG MAOZHEN, LI NING
Year of Publication 29.08.2023

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Film-forming auxiliary agent for water-based solder ball surface treating agent

by ZHANG WENQIAN, LEI YONGPING, WANG TONGJU, LIN ZIPENG
Year of Publication 29.08.2023

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Device and method for preparing uniform metal particles based on electromagnetic self-excitation disturbance

by LEI YONGPING, WANG TONGJU, FU HANGUANG, LIN JIAN
Year of Publication 25.08.2023

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Flatness detection device and detection method thereof

by GAO JIAN, XIAO GENCHANG, LEI YONGPING, LIU HUAN, ZHANG WENDE
Year of Publication 18.08.2023

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Natural gas denitrification mechanism

by LEI YONGPING, WANG MAOZHEN, WANG WEIFENG, LI NING
Year of Publication 11.08.2023

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Metal microsphere screening device and method based on electric field deflection technology

by ZHANG WENQIAN, LEI YONGPING, WANG TONGJU, ZHENG WENYAN
Year of Publication 08.08.2023

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LNG (Liquefied Natural Gas) safety relief device

by LEI YONGPING, WANG MAOZHEN, WANG WEIFENG, LI NING
Year of Publication 21.07.2023

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Natural gas pipeline accident interlocking stop valve

by LEI YONGPING, WU WANBIN, HAN YAOYONG, WANG MAOZHEN
Year of Publication 09.06.2023

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Natural gas free liquid removal device

by LEI YONGPING, WU WANBIN, HAN YAOYONG, WANG MAOZHEN
Year of Publication 30.05.2023

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Wake adaptive adjustment device and method

by CHEN WEI, LEI YONGPING
Year of Publication 18.05.2018

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Self-adaptive adjusting device and method for wakes

by CHEN WEI, LEI YONGPING
Year of Publication 23.02.2018

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Surface treatment method of solder ball for electronic packaging

by ZHANG WENQIAN, LIANG CUNLONG, LEI YONGPING, ZHANG BINGBING, WANG TONGJU, QIN ZHENZHONG
Year of Publication 30.07.2024

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Device and method for efficiently preparing uniform solder balls with sizes larger than 1mm

by ZHANG WENQIAN, LEI YONGPING, WANG TONGJU, LIN ZIPENG
Year of Publication 14.10.2022

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Flux paste for BGA (ball grid array) packaging and preparation method of flux paste

by ZHANG WENQIAN, LIANG CUNLONG, LEI YONGPING, CHEN XICHENG, WANG TONGJU, QIN ZHENZHONG
Year of Publication 11.06.2024

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