Self-aligned corrosion stop for copper C4 and wirebond
Edelstein, Daniel, Stamper, Anthony, Rubino, Judith, Sambucetti, Carlos
Year of Publication 25.11.2004
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Year of Publication 25.11.2004
Patent
Method for testing chips on flat solder bumps
Gruber, Peter, Datta, Madhav, Rubino, Judith, Sambucetti, Carlos, Walker, George
Year of Publication 06.05.2004
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Year of Publication 06.05.2004
Patent
Self-aligned corrosion stop for copper C4 and wirebond
Edelstein, Daniel, Stamper, Anthony, Rubino, Judith, Sambucetti, Carlos
Year of Publication 17.04.2003
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Year of Publication 17.04.2003
Patent
Method for forming Co-W-P-Au films
Sambucetti, Carlos, Rubino, Judith, Edelstein, Daniel, Cabral, Cyryl, Walker, George, Gaudiello, John, Wildman, Horatio
Year of Publication 05.09.2002
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Year of Publication 05.09.2002
Patent
Reduced electromigration and stressed induced migration of Cu wires by surface coating
Hu, Chao-Kun, Rosenberg, Robert, Rubino, Judith, Sambucetti, Carlos, Stamper, Anthony
Year of Publication 25.07.2002
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Year of Publication 25.07.2002
Patent
Electroless metal liner formation methods
Boettcher, Steven, Sambucetti, Carlos, Locke, Peter, Rubino, Judith, Seo, Soon-Cheon
Year of Publication 27.06.2002
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Year of Publication 27.06.2002
Patent
Copper recess process with application to selective capping and electroless plating
Dalton, Timothy, Chen, Shyng-Tsong, Davis, Kenneth, Hu, Chao-Kun, Jamin, Fen, Kaldor, Steffen, Krishnan, Mahadevaiyer, Kumar, Kaushik, Lofaro, Michael, Malhotra, Sandra, Narayan, Chandrasekhar, Rath, David, Rubino, Judith, Saenger, Katherine, Simon, Andrew, Smith, Sean, Tseng, Wei-tsu
Year of Publication 17.06.2004
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Year of Publication 17.06.2004
Patent