Formation of multisegmented plated through holes
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Year of Publication 07.11.2002
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Year of Publication 07.11.2002
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FORMATION OF MULTISEGMENTED PLATED THROUGH HOLES
Farquhar, Donald, Japp, Robert, Lauffer, John, Papathomas, Konstantinos
Year of Publication 18.07.2002
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Year of Publication 18.07.2002
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Method and structure for small pitch z-axis electrical interconnections
Curcio, Brian, Egitto, Frank, Japp, Robert, Miller, Thomas, Nguyen, Manh-Quan, Powell, Douglas
Year of Publication 08.04.2004
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Year of Publication 08.04.2004
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Electronic package with high density interconnect layer
Downes, Francis, Farquhar, Donald, Foster, Elizabeth, Japp, Robert, Jones, Gerald, Kresge, John, Sebesta, Robert, Stone, David, Wilcox, James
Year of Publication 04.07.2002
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Year of Publication 04.07.2002
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ELECTRONIC PACKAGE UTILIZING PROTECTIVE COATING
JAPP, ROBERT MAYNARD, HAVENS, ROSS DOWNEY, KNIGHT, JEFFREY ALAN, POLIKS, MARK DAVID, QUINN, ANNE M, QUINN, RONALD D
Year of Publication 09.08.2001
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Year of Publication 09.08.2001
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