Three-dimensional package and method of making the same
Huang, Min-Lung, Wang, Wei-Chung, Cheng, Po-Jen, Yee, Kuo-Chung, Su, Ching-Huei, Lo, Jian-Wen, Lin, Chian-Chi
Year of Publication 16.10.2012
Get full text
Year of Publication 16.10.2012
Patent
Three-dimensional package and method of making the same
Huang, Min-Lung, Wang, Wei-Chung, Cheng, Po-Jen, Yee, Kuo-Chung, Su, Ching-Huei, Lo, Jian-Wen, Lin, Chian-Chi
Year of Publication 22.06.2010
Get full text
Year of Publication 22.06.2010
Patent
Three-dimensional package and method of making the same
Huang, Min-Lung, Wang, Wei-Chung, Cheng, Po-Jen, Yee, Kuo-Chung, Su, Ching-Huei, Lo, Jian-Wen, Lin, Chian-Chi
Year of Publication 05.01.2010
Get full text
Year of Publication 05.01.2010
Patent
Three-dimensional package and method of making the same
Huang, Min-Lung, Wang, Wei-Chung, Cheng, Po-Jen, Yee, Kuo-Chung, Su, Ching-Huei, Lo, Jian-Wen, Lin, Chian-Chi
Year of Publication 05.05.2009
Get full text
Year of Publication 05.05.2009
Patent
Three-dimensional package and method of making the same
Huang, Min-Lung, Wang, Wei-Chung, Cheng, Po-Jen, Yee, Kuo-Chung, Su, Ching-Huei, Lo, Jian-Wen, Lin, Chian-Chi
Year of Publication 04.11.2008
Get full text
Year of Publication 04.11.2008
Patent
Water-level package with bump ring
Tao, Su, Yee, Kuo Chung, Kao, Jen Chieh, Chen, Chih Lung, Liau, Hsing Jung
Year of Publication 04.01.2005
Get full text
Year of Publication 04.01.2005
Patent
Wafer-level package with a cavity and fabricating method thereof
Tao, Su, Yee, Kuo-Chung, Kao, Jen-Chieh, Chen, Chih-Lung, Liau, Hsing-Jung
Year of Publication 23.11.2004
Get full text
Year of Publication 23.11.2004
Patent
Microsystem package structure
Tao, Su, Yee, Kuo-Chung, Kao, Jen-Chieh, Chen, Chih-Lung, Liau, Hsing-Jung
Year of Publication 26.10.2004
Get full text
Year of Publication 26.10.2004
Patent
Multichip wafer-level package and method for manufacturing the same
Tao, Su, Yee, Kuo Chung, Kao, Jen Chieh, Chen, Chih Lung, Liau, Hsing Jung
Year of Publication 27.07.2004
Get full text
Year of Publication 27.07.2004
Patent
Optical integrated circuit element package and process for making the same
Tao, Su, Yee, Kuo Chung, Kao, Jen Chieh, Chen, Chih Lung, Liau, Hsing Jung
Year of Publication 17.02.2004
Get full text
Year of Publication 17.02.2004
Patent