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"Wang, Meng-Jen"
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Search Results - "Wang, Meng-Jen"
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"Wang, Meng-Jen"
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Package process of stacked type semiconductor device package structure
by
Wang
,
Meng
-
Jen
Year of Publication
25.12.2012
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Semiconductor package structure and manufacturing process thereof
by
Wang
,
Meng
-
Jen
Year of Publication
13.11.2012
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Microelectromechanical system package
by
Wang
,
Meng Jen
Year of Publication
06.12.2011
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Method for forming vias in a substrate
by
Wang
,
Meng
-
Jen
Year of Publication
19.10.2010
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Method for forming vias in a substrate
by
Wang
,
Meng
-
Jen
Year of Publication
01.12.2009
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Method for making a stackable package
by
Yee, Kuo-Chung
,
Wang
,
Meng
-
Jen
Year of Publication
28.08.2012
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Recyclable stamp device and recyclable stamp process for wafer bond
by
Chen, Jiunn
,
Wang
,
Meng
-
Jen
Year of Publication
13.04.2010
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Multi-package module with heat spreader
by
Wang
,
Meng
-
Jen
Year of Publication
31.07.2007
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Semiconductor structure, method for manufacturing semiconductor structure and semiconductor package
by
Wang
,
Meng
-
Jen
,
Chen, Chien-Yu
Year of Publication
18.10.2011
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Method of fabricating flip chip ball grid array package
by
Wang
,
Meng
-
Jen
Year of Publication
09.05.2006
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Microelectromechanical system package and the method for manufacturing the same
by
Wang
,
Meng Jen
,
Yang, Kuo Pin
Year of Publication
16.11.2010
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12
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Multi-chips stacked package
by
Wang
,
Meng
-
Jen
Year of Publication
15.02.2005
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Package and the method for making the same, and a stacked package
by
Wang
,
Meng
-
Jen
,
Wang, Wei-Chung
Year of Publication
12.10.2010
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Multichip package
by
Wang
,
Meng Jen
Year of Publication
21.12.2004
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15
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Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via
by
Chiu, Chi-Tsung
,
Ou, Ying-Te
,
Wang
,
Meng
-
Jen
Year of Publication
08.01.2013
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Chip package structure
by
Wang
,
Meng
-
Jen
,
Chung, Chih-Ming
Year of Publication
20.05.2008
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Method for making flip chip on leadframe package
by
Wang
,
Meng
-
Jen
,
Liu, Chien
,
Huang, Tsan-Sheng
Year of Publication
16.09.2008
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Flip chip package with anti-floating structure
by
Liu, Chien
,
Wang
,
Meng
-
Jen
,
Tsai, Sheng-Tai
Year of Publication
06.05.2008
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Face-to-face multi-chip flip-chip package
by
Wang
,
Meng
-
Jen
,
Chen, Yu-Wen
Year of Publication
30.11.2004
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Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same
by
Wang
,
Meng
-
Jen
,
Yang, Kuo-Pin
,
Hsiao, Wei-Min
,
Peng, Sheng-Yang
Year of Publication
11.08.2009
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