Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
Clevenger, Larry, Dalton, Timothy Joseph, Hoinkis, Mark, Kaldor, Steffen K, Kumar, Kaushik, La Tulipe, Jr, Douglas C, Seo, Soon-Cheon, Simon, Andrew Herbert, Wang, Yun-Yu, Yang, Chih-Chao, Yang, Haining
Year of Publication 10.07.2007
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Year of Publication 10.07.2007
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Ti liner for copper interconnect with low-k dielectric
Clevenger, Larry, Klepeis, Stanley J, Lu, Hsiao-Ling, Marino, Jeffrey R, Simon, Andrew Herbert, Wang, Yun-Yu, Wong, Kwong Hon, Yang, Chih-Chao
Year of Publication 09.12.2003
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Year of Publication 09.12.2003
Patent