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"CATABAY; WILBUR"
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Search Results - "CATABAY; WILBUR"
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"CATABAY; WILBUR"
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Bi-axial texturing of high-K dielectric films to reduce leakage currents
by
Lo, Wai
,
Sun, Sey-Shing
,
Catabay
,
Wilbur
Year of Publication
07.06.2011
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Electro chemical mechanical polishing method and device for planarizing semiconductor surfaces
by
Zhu, Mei
,
Catabay
,
Wilbur
G
Year of Publication
23.10.2007
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Bi-axial texturing of high-K dielectric films to reduce leakage currents
by
Lo, Wai
,
Sun, Sey-Shing
,
Catabay
,
Wilbur
Year of Publication
17.11.2009
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Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures
by
Cui, Hao
,
Burke, Peter A
,
Catabay
,
Wilbur
G
Year of Publication
25.10.2011
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Viscous electropolishing system
by
Sukharev, Valeriy
,
Catabay
,
Wilbur
G
Year of Publication
30.08.2005
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Multi-step process for forming a barrier film for use in copper layer formation
by
Catabay
,
Wilbur
G
,
Wang, Zhihai
,
Li, Ping
Year of Publication
19.08.2008
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Electro chemical mechanical polishing method
by
Zhu, Mei
,
Catabay
,
Wilbur
G
Year of Publication
22.02.2005
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Low k dielectric composite layer for integrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning
by
Catabay
,
Wilbur
G
,
Schinella, Richard
Year of Publication
05.10.2004
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Diamond barrier layer
by
Catabay
,
Wilbur
G
,
Wang, Zhihai
Year of Publication
11.05.2004
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Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures
by
Cui, Hao
,
Burke, Peter A
,
Catabay
,
Wilbur
G
Year of Publication
01.06.2010
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Multi-step process for forming a barrier film for use in copper layer formation
by
Catabay
,
Wilbur
G
,
Wang, Zhihai
,
Li, Ping
Year of Publication
12.06.2007
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Forming copper interconnects with Sn coatings
by
Lu, Hongqiang
,
Kwak, Byung-Sung
,
Catabay
,
Wilbur
G
Year of Publication
09.03.2010
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Methods and structure for forming copper barrier layers integral with semiconductor substrates structures
by
Lu, Hong-Qiang
,
Burke, Peter A
,
Catabay
,
Wilbur
G
Year of Publication
12.01.2010
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Diamond barrier layer
by
Catabay
,
Wilbur
G
,
Wang, Zhihai
Year of Publication
29.10.2002
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Low k dielectric composite layer for intergrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning
by
Catabay
,
Wilbur
G
,
Schinella, Richard
Year of Publication
21.05.2002
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Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for integrated circuit structure
by
Catabay
,
Wilbur
G
,
Hsia, Wei-Jen
Year of Publication
16.08.2005
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Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures
by
Lu, Hong-Qiang
,
Burke, Peter A
,
Catabay
,
Wilbur
G
Year of Publication
23.09.2008
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Dual layer barrier film techniques to prevent resist poisoning
by
Lu, Hong-Qiang
,
Hsia, Wei-Jen
,
Catabay
,
Wilbur
G
Year of Publication
01.07.2008
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Via and metal line interface capable of reducing the incidence of electro-migration induced voids
by
May, Charles E
,
Catabay
,
Wilbur
G
Year of Publication
05.04.2005
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Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for intergrated circuit structure
by
Catabay
,
Wilbur
G
,
Hsia, Wei-Jen
Year of Publication
14.09.2004
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