Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
Kang, Sung K., Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W., Gosselin, Timothy, Cho, Sung-il, Yu, Jin, Choi, Won K.
Published in JOM (1989) (01.06.2004)
Published in JOM (1989) (01.06.2004)
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Journal Article
Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
KORHONEN, Tia-Marje K, TURPEINEN, Pekka, LEHMAN, Lawrence P, BOWMAN, Brian, THIEL, George H, PARKES, Raymond C, KORHONEN, Matt A, HENDERSON, Donald W, PUTTLITZ, Karl J
Published in Journal of electronic materials (01.12.2004)
Published in Journal of electronic materials (01.12.2004)
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Conference Proceeding
Journal Article
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
Kang, Sung K., Shih, Da-Yuan, Donald, NY, Henderson, W., Gosselin, Timothy, Sarkhel, Amit, Charles Goldsmith, NY, Puttlitz, Karl J., Choi, Won Kyoung
Published in JOM (1989) (01.06.2003)
Published in JOM (1989) (01.06.2003)
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Journal Article
Controlling Ag^sub 3^Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying
Kang, Sung K, Da-Yuan, Shih, Donovan, Leonard, Henderson, Donald W
Published in JOM (1989) (01.06.2004)
Get full text
Published in JOM (1989) (01.06.2004)
Journal Article
Controlling Agsub 3Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying
Kang, Sung K, Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W
Published in JOM (1989) (01.06.2004)
Get full text
Published in JOM (1989) (01.06.2004)
Journal Article
Ag^sub 3^Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
Kang, Sung K, Choi, Won Kyoung, Da-Yuan, Shih, Henderson, Donald W
Published in JOM (1989) (01.06.2003)
Get full text
Published in JOM (1989) (01.06.2003)
Journal Article