A review of the mechanical stressors efficiency applied to the ultra-thin body & buried oxide fully depleted silicon on insulator technology
Morin, Pierre, Maitrejean, Sylvain, Allibert, Frederic, Augendre, Emmanuel, Liu, Qing, Loubet, Nicolas, Grenouillet, Laurent, Pofelski, Alexandre, Chen, Kangguo, Khakifirooz, Ali, Wacquez, Romain, Reboh, Shay, Bonnevialle, Aurore, le Royer, Cyrille, Morand, Yves, Kanyandekwe, Joel, Chanemougamme, Daniel, Mignot, Yann, Escarabajal, Yann, Lherron, Benoit, Chafik, Fadoua, Pilorget, Sonia, Caubet, Pierre, Vinet, Maud, Clement, Laurent, Desalvo, Barbara, Doris, Bruce, Kleemeier, Walter
Published in Solid-state electronics (01.03.2016)
Published in Solid-state electronics (01.03.2016)
Get full text
Journal Article
56 nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme
LOQUET, Yannick, MIGNOT, Yann, MORRIS, Bryan, KLEEMEIER, Walter, LINIGER, E, SPOONER, Terry, WASKIEWICZ, Christopher, CHEN, James Hsueh-Chung, SANKARAPANDIAN, Muthumanickam, CHEN, Shyng-Tsong, FLAITZ, Philip, TOMIZAWA, Hideyuki, TSENG, Chia-Hsun, BEARD, Marcy
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
Get full text
Conference Proceeding
Journal Article
56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme
Loquet, Yannick, Mignot, Yann, Waskiewicz, Christopher, Chen, James Hsueh-Chung, Sankarapandian, Muthumanickam, Chen, Shyng-Tsong, Flaitz, Philip, Tomizawa, Hideyuki, Tseng, Chia-Hsun, Beard, Marcy, Morris, Bryan, Kleemeier, Walter, Liniger, E., Spooner, Terry
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
Get full text
Journal Article