Effect of Molybdenum on the Microstructures and Properties of Stainless Steel Coatings by Laser Cladding
Wang, Kaiming, Chang, Baohua, Chen, Jiongshen, Fu, Hanguang, Lin, Yinghua, Lei, Yongping
Published in Applied sciences (15.10.2017)
Published in Applied sciences (15.10.2017)
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Journal Article
Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy
Dong, Wenxing, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of electronic materials (01.07.2008)
Published in Journal of electronic materials (01.07.2008)
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Journal Article
Effect of Cobalt on Microstructure and Wear Resistance of Ni-Based Alloy Coating Fabricated by Laser Cladding
Wang, Kaiming, Chang, Baohua, Lei, Yongping, Fu, Hanguang, Lin, Yinghua
Published in Metals (Basel ) (01.12.2017)
Published in Metals (Basel ) (01.12.2017)
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Journal Article
Investigation of rare earth-doped BiAg high-temperature solders
Shi, Yaowu, Fang, Weiping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.09.2010)
Published in Journal of materials science. Materials in electronics (01.09.2010)
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Journal Article
Correlation Between Tensile Strength and Hardness of Electron Beam Welded TC4-DT Joints
Lu, Wei, Shi, Yaowu, Li, Xiaoyan, Lei, Yongping
Published in Journal of materials engineering and performance (01.06.2013)
Published in Journal of materials engineering and performance (01.06.2013)
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Journal Article
Microstructure and Properties of Cast B-Bearing High Speed Steel
Fu, Hanguang, Ma, Shengqiang, Hou, Jianqiang, Lei, Yongping, Xing, Jiandong
Published in Journal of materials engineering and performance (01.04.2013)
Published in Journal of materials engineering and performance (01.04.2013)
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Journal Article
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging
Hao, Hu, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of electronic materials (2008)
Published in Journal of electronic materials (2008)
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Journal Article
Conference Proceeding
Fracture assessment for electron beam welded damage tolerant Ti-6Al-4V alloy by the FITNET procedure
Lu, Wei, Shi, Yaowu, Li, Xiaoyan, Lei, Yongping
Published in Chinese journal of mechanical engineering (01.09.2013)
Published in Chinese journal of mechanical engineering (01.09.2013)
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Journal Article
Creep property of composite solders reinforced by nano-sized particles
Shi, Yaowu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.04.2008)
Published in Journal of materials science. Materials in electronics (01.04.2008)
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Journal Article
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles
Shi, Yaowu, Liu, Jianping, Yan, Yanfu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.04.2008)
Published in Journal of electronic materials (01.04.2008)
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Journal Article
Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint
Li, Bo, Shi, Yaowu, Lei, Yongping, Guo, Fu, Xia, Zhidong, Zong, Bin
Published in Journal of electronic materials (01.03.2005)
Published in Journal of electronic materials (01.03.2005)
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Journal Article
Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints
Li, Guangdong, Shi, Yaowu, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.02.2009)
Published in Journal of materials science. Materials in electronics (01.02.2009)
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Journal Article
Limit load solution for electron beam welded joints with single edge weld center crack in tension
Lu, Wei, Shi, Yaowu, Li, Xiaoyan, Lei, Yongping
Published in Chinese journal of mechanical engineering (01.05.2012)
Published in Chinese journal of mechanical engineering (01.05.2012)
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Journal Article
Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration
Guo, Fu, Xu, Guangchen, Sun, Jia, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan
Published in Journal of electronic materials (01.12.2009)
Published in Journal of electronic materials (01.12.2009)
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Journal Article
Conference Proceeding
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test
Zhang, Ning, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.10.2008)
Published in Journal of electronic materials (01.10.2008)
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Journal Article
Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints
Dong, Wenxing, Shi, Yaowu, Lei, Yongping, Xia, Zhidong, Guo, Fu
Published in Journal of electronic materials (01.09.2009)
Published in Journal of electronic materials (01.09.2009)
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Journal Article
Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles
Shi, Yaowu, Yan, Yanfu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.09.2009)
Published in Journal of electronic materials (01.09.2009)
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Journal Article