Improved Copper Damascene Wires Using Direct Plate on Cobalt Process
Brogan, Lee J, Liu, Yihua, Huie, Matthew M., Reid, Jonathan David, Kelly, James, Shobha, Hosadurga k, Huang, Huai, Motoyama, Koichi, Hu, Chao-kun
Published in Meeting abstracts (Electrochemical Society) (01.05.2019)
Published in Meeting abstracts (Electrochemical Society) (01.05.2019)
Get full text
Journal Article
Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications
Sun, Xiaoxuan, Peethala, Brown, Hopstaken, Marinus, Hu, Chao-kun, Mclaughlin, Paul S, van der Straten, O., Demarest, James, Motoyama, K., Nogami, Takeshi, Lin, Xuan, Zhang, Xunyuan, Kelly, James
Published in Meeting abstracts (Electrochemical Society) (01.09.2017)
Published in Meeting abstracts (Electrochemical Society) (01.09.2017)
Get full text
Journal Article
Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect
Nguyen, Son van, Shobha, Hosadurga k, Haigh, Thomas J, Yao, Yiping, Tai, Leo, Cohen, Stephan A, Shaw, Thomas M, Hu, Chao-kun, Liniger, Eric, Virwani, Kumar, Kellock, Andrew J, Canaperi, Donald F
Published in Meeting abstracts (Electrochemical Society) (15.04.2017)
Published in Meeting abstracts (Electrochemical Society) (15.04.2017)
Get full text
Journal Article
Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects
Priyadarshini, Deepika, Nguyen, Son van, Shobha, Hosadurga k, Ryan, E. T., Gates, Steven M, Huang, Huai, Chen, James, Liniger, Eric, Cohen, Stephan A, Hu, Chao-kun, Madan, Anita, Adams, Edward, Molis, Steven E, Haigh, Thomas J, Bonilla, Griselda, Standaert, Theodorus, Canaperi, Donald F, Grill, Alfred
Published in Meeting abstracts (Electrochemical Society) (07.07.2015)
Published in Meeting abstracts (Electrochemical Society) (07.07.2015)
Get full text
Journal Article
Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects
Nguyen, Son van, Priyadarshini, Deepika, Shobha, Hosadurga k, Haigh, Thomas J, Hu, Chao-kun, Cohen, Stephan A, Liniger, Eric, Shaw, Thomas M, Adams, Edward D, Burnham, Jay, Madan, Anita, Klymko, Nancy R, Parks, Christopher, Yang, Daewon, Molis, Steven E, Lin, Y, Bonilla, Griselda, Grill, Alfred, Edelstein, Daniel, Canaperi, Donald F, Xia, Li-Qun, Reiter, Steven, Balseanu, Mihaela, Shek, Mei-Yee
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
Get full text
Journal Article
Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects
Kelly, James, Nogami, Takeshi, Parks, Christopher, Van der Straten, O., Demarest, James, Li, Juntao, DeHaven, Patrick, Hu, Chao-Kun, Liniger, Eric, Penny, Chris, Vo, Tuan
Published in Meeting abstracts (Electrochemical Society) (01.08.2011)
Published in Meeting abstracts (Electrochemical Society) (01.08.2011)
Get full text
Journal Article
Enhanced Electromigration in Cu Interconnects Using Upper Level Dummy Vias
Hu, Chao-Kun, Greco, S., McLaughlin, P., Gignac, L., Liniger, E., Demarest, J., Huang, Elbert, Yang, C.
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Get full text
Journal Article
Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices
Nguyen, Son V., Haigh, Thomas, Tagami, Masayoshi, Grill, Alfred, Cohen, Stephan, Shobha, Hosadurga, Hu, Chao-Kun, Adams, Ed, Liniger, Eric, Shaw, Thomas, Cheng, Tien, Yusuff, Hakeem, Xu, Yiheng, Ko, Tze-Man, Molis, Steven, Spooner, Terry, Skordas, Spyridon, Liu, Xiao Hu, Bonilla, Griselda, Edelstein, Dan
Published in Meeting abstracts (Electrochemical Society) (01.08.2011)
Published in Meeting abstracts (Electrochemical Society) (01.08.2011)
Get full text
Journal Article
Self-Assembly Based Air-Gap Integration
Ponoth, Shom, Horak, Dave, Nitta, Satya, Colburn, Matthew, Breyta, Greg, Huang, Elbert, Sucharitaves, Jeanne Tania, Landis, Howard, Lisi, Anthony, Liu, Xiao, Vo, Tuan, Johnson, Richard, Li, Wai-kin, Purushothaman, Sampath, Cohen, Stephan, Hu, Chao-Kun, Kim, Ho-Cheol, Clevenger, Larry, Fuller, Nicholas, Nogami, Takeshi, Spooner, Terry, Edelstein, Dan
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Get full text
Journal Article