Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
Fengze Hou, Tingyu Lin, Liqiang Cao, Fengman Liu, Jun Li, Xuejun Fan, Zhang, G. Q.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
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Journal Article
Design and Implementation of a High-Coupling and Multichannel Optical Transceiver With a Novel Packaging Structure
He, Huimin, Liu, Fengman, Xue, Haiyun, Wu, Peng, Song, Mangu, Chen, Cheng, Sun, Yu, Cao, Liqiang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2017)
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Journal Article
A 9pJ/bit SOP optical transceiver with 80 Gbps two-way bandwidth
Liu Fengman, Li Baoxia, Li Zhihua, Wan Lixi, Gao Wei, Chu Yanbiao, Du Tianmin, Song Jian, Xiang Haifei, Wang Haidong, Yang Kun, Yang Binbin
Published in 2011 Asia Communications and Photonics Conference and Exhibition (ACP) (2011)
Published in 2011 Asia Communications and Photonics Conference and Exhibition (ACP) (2011)
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Conference Proceeding
Optimizing Hierarchical 3-D Floorplanning with simulated annealing Algorithm
Chengyi, Liao, Qi, Zheng, Fengman, Liu, Huimin, He, Qidong, Wang
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Design and Realization of Multi-Channel and High-Bandwidth 2.5D Transmitter Integrated With Silicon Photonic MZM
He, Huimin, Xue, Haiyun, Sun, Yu, Liu, Fengman, Cao, Liqiang
Published in Journal of lightwave technology (01.08.2022)
Published in Journal of lightwave technology (01.08.2022)
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Journal Article
Challenges and Technologies of Frontside Via-Last Active-Interposer Processes on Low-k Material for 3D Chiplet
Cao, Rui, He, Huimin, Chen, Lijun, Liao, Chengyi, Liu, Fengman, Cao, Liqiang, Wang, Qidong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (22.08.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (22.08.2024)
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Journal Article
Enhanced Fabrication and Assembly of 3-D Chiplets Based on Active Interposer with Frontside Via-last TSVs
Liao, Chengyi, He, Huimin, Wang, Xugang, Cao, Rui, Chen, Lijun, Peng, Cheng, Liu, Fengman, Cao, Liqiang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (14.08.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (14.08.2024)
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Journal Article
High Positional Resolution Pin-Cushion Position Sensitive Detector by Deliberately Introducing Barrel Distortion
Sun, Siwei, Zheng, Qi, Meng, Xiangxu, Sun, Peng, Liu, Fengman, Cao, Liqiang
Published in IEEE sensors journal (15.01.2022)
Published in IEEE sensors journal (15.01.2022)
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Journal Article
Research on 3D Optical Module Integrating Edge Coupler and TSV
Zheng, Qi, Yang, Peng, Xue, Haiyun, He, Huimin, Cao, Rui, Dai, Fengwei, Sun, Siwei, Liu, Fengman, Wang, Qidong, Cao, Liqiang, Chen, Lijun, Sun, Xuyan, Sun, Peng
Published in Journal of lightwave technology (15.09.2022)
Published in Journal of lightwave technology (15.09.2022)
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Journal Article
Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects
He, Jian, Lu, Donglai, Xue, Haiyun, Chen, Sikai, Liu, Han, Li, Leliang, Li, Guike, Zhang, Zhao, Liu, Jian, Liu, Liyuan, Wu, Nanjian, Yu, Ningmei, Liu, Fengman, Xiao, Xi, Chen, Yong, Qi, Nan
Published in IEEE transactions on circuits and systems. I, Regular papers (01.11.2022)
Published in IEEE transactions on circuits and systems. I, Regular papers (01.11.2022)
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Journal Article
Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm2 Heat Dissipation
Hou, Fengze, Zhang, Hengyun, Huang, Dezhu, Fan, Jiajie, Liu, Fengman, Lin, Tingyu, Cao, Liqiang, Fan, Xuejun, Ferreira, Braham, Zhang, Guoqi
Published in IEEE transactions on power electronics (01.10.2020)
Published in IEEE transactions on power electronics (01.10.2020)
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Journal Article
Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm 2 Heat Dissipation
Hou, Fengze, Zhang, Hengyun, Huang, Dezhu, Fan, Jiajie, Liu, Fengman, Lin, Tingyu, Cao, Liqiang, Fan, Xuejun, Ferreira, Braham, Zhang, Guoqi
Published in IEEE transactions on power electronics (01.10.2020)
Published in IEEE transactions on power electronics (01.10.2020)
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Journal Article
Thermal characterization of a novel 3D stacked package structure by CFD simulation
Cheng Chen, Delong Qiu, Fengze Hou, Fengman Liu, Meiying Su, Qidong Wang, Liqiang Cao, Lixi Wan
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
A 2T P-Channel Logic Flash Cell for Reconfigurable Interconnection in Chiplet-Based Computing-In-Memory Accelerators
Li, Weizeng, Wang, Linfang, Li, Zhi, Ye, Wang, Zhou, Zhidao, Zhou, Haiyang, Gao, Hanghang, Yue, Jinshan, Hu, Hongyang, Liu, Fengman, Luo, Qing, Dou, Chunmeng
Published in 2024 IEEE International Symposium on Circuits and Systems (ISCAS) (19.05.2024)
Published in 2024 IEEE International Symposium on Circuits and Systems (ISCAS) (19.05.2024)
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Conference Proceeding
Electrical characterization and analysis on the via-solder ball structure
Yi He, Jun Li, Fengman Liu, Peng Wu, Liqiang Cao
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Substrate design of a 3-D microwave front-end multi-chip module with antennas integrated
Peng Wu, Huimin He, Yi He, Lixi Wan, Fengman Liu, Jun Li, Liqiang Cao
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
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Conference Proceeding
Optimization Design of 2.5D TSV Package Using Thermo-Electrical Co-Simulation Method
Fengze Hou, Yunyan Zhou, Fengman Liu, Meiying Su, Cheng Chen, Jun Li, Tingyu Lin, Liqiang Cao
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Thermal management of 3D RF PoP based on ceramic substrate
Fengze Hou, Fengman Liu, Yi He, Xiaomeng Wu, Xia Zhang, Liqiang Cao, Yuan Lu, Shangguan, Dongkai
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding