A 150 MS/s 133 μW 7 bit ADC in 90 nm Digital CMOS
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Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications
Wei, Tiwei, Oprins, Herman, Cherman, Vladimir, Yang, Zhi, Rivera, Kathryn C., Plas, Geert Van der, Pawlak, Bartlomiej J., England, Luke, Beyne, Eric, Baelmans, Martine
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2021)
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A 0.65-to-1.4 nJ/Burst 3-to-10 GHz UWB All-Digital TX in 90 nm CMOS for IEEE 802.15.4a
Ryckaert, J., Van der Plas, G., De Heyn, V., Desset, C., Van Poucke, B., Craninckx, J.
Published in IEEE journal of solid-state circuits (01.12.2007)
Published in IEEE journal of solid-state circuits (01.12.2007)
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Conference Proceeding
A CMOS Ultra-Wideband Receiver for Low Data-Rate Communication
Ryckaert, J., Verhelst, M., Badaroglu, M., D'Amico, S., De Heyn, V., Desset, C., Nuzzo, P., Van Poucke, B., Wambacq, P., Baschirotto, A., Dehaene, W., Van der Plas, G.
Published in IEEE journal of solid-state circuits (01.11.2007)
Published in IEEE journal of solid-state circuits (01.11.2007)
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Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits
Araga, Yuuki, Nagata, Makoto, Van der Plas, Geert, Marchal, Paul, Libois, Michael, La Manna, Antonio, Wenqi Zhang, Beyer, Gerald, Beyne, Eric
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2014)
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Journal Article
A 0.65-to-1.4nJ/burst 3-to-10GHz UWB Digital TX in 90nm CMOS for IEEE 802.15.4a
Ryckaert, Julien, van der Plas, Geert, de Heyn, Vincent, Desset, Claude, Vanwijnsberghe, Geert, van Poucke, Bart, Craninckx, Jan
Published in 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (01.02.2007)
Published in 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (01.02.2007)
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Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
Jourdain, Anne, Schleicher, Filip, De Vos, Joeri, Stucchi, Michele, Chery, Emmanuel, Miller, Andy, Beyer, Gerald, Van der Plas, Geert, Walsby, Edward, Roberts, Kerry, Ashraf, Huma, Thomas, Dave, Beyne, Eric
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Modeling of Substrate Noise Generation, Isolation, and Impact for an LC-VCO and a Digital Modem on a Lightly-Doped Substrate
Soens, C., Van der Plas, G., Badaroglu, M., Wambacq, P., Donnay, S., Rolain, Y., Kuijk, M.
Published in IEEE journal of solid-state circuits (01.09.2006)
Published in IEEE journal of solid-state circuits (01.09.2006)
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A fast start-up 3GHz-10GHz digitally controlled oscillator for UWB impulse radio in 90nm CMOS
De Heyn, V., Van der Plas, G., Ryckaert, J., Craninckx, J.
Published in ESSCIRC 2007 - 33rd European Solid-State Circuits Conference (01.09.2007)
Published in ESSCIRC 2007 - 33rd European Solid-State Circuits Conference (01.09.2007)
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Conference Proceeding
Efficient Backside Power Delivery for High-Performance Computing Systems
Lin, Hesheng, van der Plas, Geert, Sun, Xiao, Velenis, Dimitrios, Catthoor, Francky, Lauwereins, Rudy, Beyne, Eric
Published in IEEE transactions on very large scale integration (VLSI) systems (01.11.2022)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.11.2022)
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Entire Domain Basis Function Expansion of the Differential Surface Admittance for Efficient Broadband Characterization of Lossy Interconnects
Huynen, Martijn, Kapusuz, Kamil Yavuz, Sun, Xiao, Van der Plas, Geert, Beyne, Eric, De Zutter, Daniel, Vande Ginste, Dries
Published in IEEE transactions on microwave theory and techniques (01.04.2020)
Published in IEEE transactions on microwave theory and techniques (01.04.2020)
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Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies
Bosman, Dries, Huynen, Martijn, De Zutter, Daniel, Sun, Xiao, Pantano, Nicolas, Van der Plas, Geert, Beyne, Eric, Vande Ginste, Dries
Published in IEEE transactions on microwave theory and techniques (01.07.2023)
Published in IEEE transactions on microwave theory and techniques (01.07.2023)
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Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling
Elsinger, Georg, Oprins, Herman, Cherman, Vladimir, Van der Plas, Geert, Beyne, Eric, De Wolf, Ingrid
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2024)
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84%-Efficiency Fully Integrated Voltage Regulator for Computing Systems Enabled by 2.5-D High-Density MIM Capacitor
Lin, Hesheng, Velenis, Dimitrios, Nolmans, Philip, Sun, Xiao, Catthoor, Francky, Lauwereins, Rudy, Van der Plas, Geert, Beyne, Eric
Published in IEEE transactions on very large scale integration (VLSI) systems (01.05.2022)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.05.2022)
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Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN)
Beyne, Eric, Jourdain, Anne, Beyer, Gerald
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)
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