Numerical Analysis of 3D CSP MEMS Under Thermal Cycle-Impact Coupled Multiphysics Loads
Zhang, Shuye, Sun, Mingjia, Yang, Jianqun, Li, Xingji, He, Peng, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2023)
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Journal Article
Acoustic Matching Layer Films Using B-Stage Thermosetting Polymer Resins for Ultrasound Transducer Applications
Park, Jae-Hyeong, Lee, Sang-Mok, Park, Jongcheol, Lee, Hyunjoo Jenny, Paik, Kyung-Wook
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.10.2020)
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.10.2020)
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Journal Article
A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling
Zhang, Shuye, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
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Journal Article
Piezoelectric Ceramics and Flexible Printed Circuits' Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly
Park, Jae-Hyeong, Park, Jong Cheol, Lee, SeYong, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2019)
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Journal Article
A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications
Zhang, Shuye, Lin, Tiesong, He, Peng, Zhao, Ning, Huang, Mingliang, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2017)
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Journal Article
Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers
Park, Jae-Hyeong, Park, Jong Cheol, Shin, SangMyung, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2019)
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Journal Article
A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 °C Bonding Temperature
Zhang, Shuye, Yang, Ming, Wu, Yang, Du, Jikun, Lin, Tiesong, He, Peng, Huang, Mingliang, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2018)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2018)
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Journal Article
Effects of the Nylon Anchoring Polymer Layer on the Conductive Particle Movements of Anisotropic Conductive Films for Ultrafine Pitch Chip-on-Glass Applications
Yoon, Dal-Jin, Lee, Sang-Hoon, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2018)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2018)
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Journal Article
A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films
Pan, Yan, Oh, Seung-Jin, Kim, Ji-Hye, Kim, Taek-Soo, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2020)
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Journal Article
Joint Morphologies and Failure Mechanisms of Anisotropic Conductive Films (ACFs) During a Power Handling Capability Test for Flex-On-Board Applications
Zhang, Shuye, Park, Jae-Hyeong, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2016)
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Journal Article
A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine-Pitch Flex-on-Flex (FOF) Interconnection
Song, Lu, Yoon, Dal-Jin, Zhang, Shuye, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2020)
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Journal Article
Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn-Ag Bumps
Lee, HanMin, Lee, SeYong, Choi, TaeJin, Park, SooIn, Ko, Eun Kyoung, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2020)
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Journal Article
A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties
Byeon, Jun-Ho, Yoon, Dal-Jin, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2019)
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Journal Article
A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates
Jung, Seung-Yoon, Lee, Tae-Ik, Cho, Minsun, Kim, Taek-Soo, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2020)
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Journal Article
A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films
Jung, Seung-Yoon, Oh, Seung Jin, Lee, Tae-Ik, Kim, Taek-Soo, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2020)
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Journal Article
Effects of Polyacrylonitrile Anchoring Polymer Layer Solder Anisotropic Conductive Films on the Solder Ball Movement for Fine-Pitch Flex-on-Flex (FOF) Assembly
Yoon, Dal-Jin, Lee, Sang-Hoon, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2019)
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Journal Article
The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications
Kim, Ji-Hye, Lee, Tae-Ik, Kim, Taek-Soo, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
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Journal Article
A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding
Zhang, Shuye, Kim, Seung-Ho, Kim, Tae-Wan, Kim, Yoo-Sun, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2015)
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Journal Article
Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications
Kim, Ji-Hye, Lee, Tae-Ik, Shin, Ji-Won, Kim, Taek-Soo, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
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Journal Article