Thermal SPICE Modeling of FinFET and BEOL Considering Frequency-Dependent Transient Response, 3-D Heat Flow, Boundary/Alloy Scattering, and Interfacial Thermal Resistance
Chung, Chia-Che, Lin, H. H., Wan, W. K., Yang, M.-T., Liu, C. W.
Published in IEEE transactions on electron devices (01.06.2019)
Published in IEEE transactions on electron devices (01.06.2019)
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Journal Article
Self-Heating Induced Interchannel Vt Difference of Vertically Stacked Si Nanosheet Gate-All-Around MOSFETs
Chung, Chia-Che, Ye, Hung-Yu, Lin, H. H., Wan, W. K., Yang, M.-T., Liu, C. W.
Published in IEEE electron device letters (01.12.2019)
Published in IEEE electron device letters (01.12.2019)
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Journal Article
Novel RDL Design of Wafer-Level Packaging for Signal/Power Integrity in LPDDR4 Application
Kai-Bin Wu, Tsung-Yi Kuo, Cheng-Chou Hung, Lin, Benson, I-Hsuan Peng, Yang, M.-T, Ruey-Beei Wu
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2018)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2018)
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Asymmetric Keep-Out Zone of Through-Silicon Via Using 28-nm Technology Node
Jhih-Yang Yan, Sun-Rong Jan, Yi-Chung Huang, Huang-Siang Lan, Huang, Y.-H, Bigchoug Hung, Chan, K.-T, Huang, Michael, Yang, M.-T, Liu, C. W.
Published in IEEE electron device letters (01.09.2015)
Published in IEEE electron device letters (01.09.2015)
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Journal Article
Comprehensive Thermal SPICE Modeling of FinFETs and BEOL with Layout Flexibility Considering Frequency Dependent Thermal Time Constant, 3D Heat Flows, Boundary/Alloy Scattering, and Interfacial Thermal Resistance with Circuit Level Reliability Evaluation
Yan, Jhih-Yang, Chung, Chia-Che, Jan, Sun-Rong, Lin, H. H., Wan, W. K., Yang, M.-T., Liu, C. W.
Published in 2018 IEEE Symposium on VLSI Technology (01.06.2018)
Published in 2018 IEEE Symposium on VLSI Technology (01.06.2018)
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Conference Proceeding
The Invariance of Characteristic Current Densities in Nanoscale MOSFETs and Its Impact on Algorithmic Design Methodologies and Design Porting of Si(Ge) (Bi)CMOS High-Speed Building Blocks
Dickson, T.O., Yau, K.H.K., Chalvatzis, T., Mangan, A.M., Laskin, E., Beerkens, R., Westergaard, P., Tazlauanu, M., Ming-Ta Yang, Voinigescu, S.P.
Published in IEEE journal of solid-state circuits (01.08.2006)
Published in IEEE journal of solid-state circuits (01.08.2006)
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Conference Proceeding
Interpretable Neural Network to Model and to Reduce Self-Heating of FinFET Circuitry
Chung, Chia-Che, Lin, Hsin-Cheng, Lin, H. H., Wan, W. K., Yang, M. T., Liu, C. W.
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
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Conference Proceeding
Modeling and optimization of substrate resistance for RF-CMOS
Chang, R.T., Ming-Ta Yang, Ho, P.P.C., Yo-Jen Wang, Yu-Tai Chia, Boon-Khim Liew, Yue, C.P., Wong, S.S.
Published in IEEE transactions on electron devices (01.03.2004)
Published in IEEE transactions on electron devices (01.03.2004)
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Journal Article
Compact modeling and simulation of TSV with experimental verification
Jhih-Yang Yan, Sun-Rong Jan, Yi-Chung Huang, Huang-Siang Lan, Liu, C. W., Huang, Y.-H, Bigchoug Hung, Chan, K.-T, Huang, Michael, Yang, M.-T
Published in 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2016)
Published in 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2016)
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Conference Proceeding
A High-Gain, Low-Noise, +6dBm PA in 90nm CMOS for 60-GHz Radio
Khanpour, M., Voinigescu, S.P., Yang, M.T.
Published in 2007 IEEE Compound Semiconductor Integrated Circuits Symposium (01.10.2007)
Published in 2007 IEEE Compound Semiconductor Integrated Circuits Symposium (01.10.2007)
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Conference Proceeding
Thermal resistance modeling of back-end interconnect and intrinsic FinFETs, and transient simulation of inverters with capacitive loading effects
Jhih-Yang Yan, Sun-Rong Jan, Yu-Jiun Peng, Lin, H. H., Wan, W. K., Huang, Y.-H, Bigchoug Hung, Chan, K.-T, Huang, Michael, Yang, M.-T, Liu, C. W.
Published in 2016 IEEE International Electron Devices Meeting (IEDM) (01.12.2016)
Published in 2016 IEEE International Electron Devices Meeting (IEDM) (01.12.2016)
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Conference Proceeding
Self-Heating Induced Interchannel V t Difference of Vertically Stacked Si Nanosheet Gate-All-Around MOSFETs
Chung, Chia-Che, Ye, Hung-Yu, Lin, H. H., Wan, W. K., Yang, M.-T., Liu, C. W.
Published in IEEE electron device letters (01.12.2019)
Published in IEEE electron device letters (01.12.2019)
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Journal Article
On the millimeter-wave characteristics and model of on-chip interconnect transmission lines up to 110 GHz
Yang, M.T., Ho, P.P.C., Yeh, T.J., Wang, Y.J., Kuo, D.C.W., Kuo, C.W., Yang, S.C., Mangan, A., Voinigescu, S.P., Liu, S.
Published in IEEE MTT-S International Microwave Symposium Digest, 2005 (2005)
Published in IEEE MTT-S International Microwave Symposium Digest, 2005 (2005)
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Conference Proceeding
A novel dual focus objective lens for DVD/CD pick-up head
Pei-Yih Liu, Shieh, H.-P.D., Jau-Jiu Ju, Shin-Ter Tsai, Tsung-Ming Yang, Tsung-Kai Chang, Jiin-Song Liu
Published in IEEE transactions on magnetics (01.03.1998)
Published in IEEE transactions on magnetics (01.03.1998)
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Conference Proceeding
Foundry 0.13 μm CMOS modeling for MS/μwave SOC design at 10 GHz and beyond
YANG, M. T, YEH, T. J, WANG, Y. J, HO, Patricia P. C, LIN, Y. R, KUO, Darry C. W, VOINIGESCU, Sorin P, TAZLAUANU, Mihai, CHIA, Y. T, YOUNG, K. L
Year of Publication 2004
Year of Publication 2004
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Conference Proceeding
De-embedding transmission line measurements for accurate modeling of IC designs
Mangan, A.M., Voinigescu, S.P., Ming-Ta Yang, Tazlauanu, M.
Published in IEEE transactions on electron devices (01.02.2006)
Published in IEEE transactions on electron devices (01.02.2006)
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Journal Article
Characterization and model of high quality factor and broadband integrated inductor on Si-substrate
Yang, M.T., Yeh, T.J., Lin, W.C., Hsu, H.M., Ho, P.P.C., Wang, Y.J., Chia, Y.T., Tang, D.D.L.
Published in IEEE MTT-S International Microwave Symposium Digest, 2003 (2003)
Published in IEEE MTT-S International Microwave Symposium Digest, 2003 (2003)
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Conference Proceeding
A laser noise reduction method for holographic pickup heads
Freeman, M.O., Hsi-Fu Shih, Tzu-Ping Yang, Jin-Kang Wang, Tsung-Ming Yang, Kuo-Lung Lei, Yuh-Horng Chuang, Ming-Wen Chang
Published in IEEE transactions on magnetics (01.03.1998)
Published in IEEE transactions on magnetics (01.03.1998)
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