Thermal design and transient analysis of insulated gate bipolar transistors of power module
Tuan-Yu Hung, Shih-Ying Chiang, Chan-Yen Chou, Chien-Chia Chiu, Kuo-Ning Chiang
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
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Conference Proceeding
Transient thermal analysis of high-concentration photovoltaic cell module subjected to coupled thermal and power cycling test conditions
Ning-Yuan Wang, Shih-Ying Chiang, Tsung-Lin Chou, Zun-Hao Shih, Hwen-Fen Hong, Kuo-Ning Chiang
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
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Conference Proceeding
Electro-thermal analysis of the Insulated Gate Bipolar Transistor module subjected to power cycling test using specified boundary condition technology
Shih-Ying Chiang, Tuan-Yu Hung, Hsien-Chih Ou, Kuo-Ning Chiang
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
Life prediction of high concentration photovoltaic modules subjected to thermal cycling test
Ning-Yuan Wang, Shih-Ying Chiang, Tsung-Lin Chou, Hsin-Li Lee, Kuo-Ning Chiang
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding
Reliability analysis of copper interconnections of system-in-packaging
Shin-Yueh Yang, Shih-Ying Chiang, Chan-Yen Chou, Ming-Chih Yew, Kuo-Ning Chiang
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
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Conference Proceeding
Reliability analysis of copper interconnection in system-in-package structure
Shih-Ying Chiang, Chan-Yan Chou, Ming-Chih Yew, Kuo-Ning Chiang
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
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Conference Proceeding
Reliability Analysis of copper interconnections of system-in-packaging structure using finite element method
Shih-Ying Chiang, Shin-Yueh Yang, Chan-Yen Chou, Ming-Chih Yew, Kuo-Ning Chiang
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
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Conference Proceeding