Flip Chip Assembly of Thinned Silicon Die on Flex Substrates
Banda, C., Johnson, R.W., Tan Zhang, Zhenwei Hou, Charles, H.K.
Published in IEEE transactions on electronics packaging manufacturing (01.01.2008)
Published in IEEE transactions on electronics packaging manufacturing (01.01.2008)
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Journal Article
Multisite microprobes for neural recordings
Blum, N.A., Carkhuff, B.G., Charles, H.K., Edwards, R.L., Meyer, R.A.
Published in IEEE transactions on biomedical engineering (01.01.1991)
Published in IEEE transactions on biomedical engineering (01.01.1991)
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Journal Article
Electronics, energy, and the environment
Charles, H.K., Sinnadurai, N.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Electronics and its impact on energy and the environment
Sinnadurai, N., Charles, H.K.
Published in 2009 32nd International Spring Seminar on Electronics Technology (01.05.2009)
Published in 2009 32nd International Spring Seminar on Electronics Technology (01.05.2009)
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Conference Proceeding
Microstrip antenna tuning using variable reactive microelectromechanical systems
Yee, S. C., Anderson, C. R., Charles, H. K., Firebaugh, S. L., Mechtel, D. M.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Packaging With Multichip Modules
Charles, H.K.
Published in Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium (1992)
Published in Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium (1992)
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Conference Proceeding
Electronics and the environment
Charles, H.K., Simadurai, N.
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding
Known good die, die replacement (rework), and their influences on multichip module costs
Petek, J.M., Charles, H.K.
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
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Conference Proceeding
Journal Article
The Practical Implementation of Voltage Contrast as a Diagnostic Tool
Bertsche, Kirk J., Charles, Harry K.
Published in 20th International Reliability Physics Symposium (01.03.1982)
Published in 20th International Reliability Physics Symposium (01.03.1982)
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Conference Proceeding
The Reflow Attachment and Reliability Testing of Ceramic Chip Carriers
Charles, Harry K., Romenesko, Bruce M.
Published in 19th International Reliability Physics Symposium (01.04.1981)
Published in 19th International Reliability Physics Symposium (01.04.1981)
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Conference Proceeding
MCM structures with poled dielectrics to improve testability
Mechtel, D.M., Charles, H.K., Francomacaro, A.S.
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
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Conference Proceeding
Journal Article