A Comprehensive Study of Solder Joint Reliability Dependent on Temperature Cycling Profiles and Material Selections with Emphasis on an Improved Solder Fatigue Lifetime Model
Son, Bongchan, Chae, Seung-Hyun, Noh, Seungkwon, Lee, KilJae, Kim, Sangdeok
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints
Huang-Lin Chao, Seung-Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu, Im, J., Ho, P.S.
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
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Conference Proceeding
Mechanism of void formation in Cu post solder joint under electromigration
Min-Young Kim, Liang-Shan Chen, Seung-Hyun Chae, Choong-Un Kim
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect
Yiwei Wang, Seung-Hyun Chae, Dunne, R., Takahashi, Y., Mawatari, K., Steinmann, P., Bonifield, T., Tengfei Jiang, Im, J., Ho, P. S.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints
Seung-Hyun Chae, Chao, B., Xuefeng Zhang, Im, J., Ho, P.S.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Current Carrying Capability of Sn0.7Cu Solder Bumps in Flip Chip Modules for High Power Applications
Ramanathan, L.N., Lee, T.-Y.T., Jin-Wook Jang, Seung-Hyun Chae, Ho, P.S.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.01.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.01.2007)
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Conference Proceeding
Kinetic Analysis of Electromigration Enhanced Intermetallic Growth and Void Formation in Pb-Free Solders
Brook Chao, Seung-Hyun Chae, Xuefeng Zhang, Ho, P.S.
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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Conference Proceeding
Electromigration lifetime statistics for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
Seung-Hyun Chae, Xuefeng Zhang, Huang-Lin Chao, Kuan-Hsun Lu, Ho, P.S., Min Ding, Peng Su, Trent Uehling, Ramanathan, L.N.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding