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Liang, Wan-Ling, Le, Xiu, Li, Hou-Jin, Yang, Xiang-Ling, Chen, Jun-Xiong, Xu, Jun, Liu, Huan-Liang, Wang, Lai-You, Wang, Kun-Teng, Hu, Kun-Chao, Yang, De-Po, Lan, Wen-Jian
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Published in Marine drugs (24.11.2014)
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Secondary Metabolites from the Marine-Derived Fungus Dichotomomyces sp. L-8 and Their Cytotoxic Activity
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Published in Molecules (Basel, Switzerland) (11.03.2017)
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Hu, Kun-Chao, Xu, Meng-Yang, Li, Hou-Jin, Yuan, Jie, Tang, Ge, Xu, Jun, Yang, De-Po, Lan, Wen-Jian
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A Novel Method to Fabricate CNT/Mg-6Zn Composites with High Strengthening Efficiency
Shi, Hailong, Wang, Xiaojun, Li, Chendong, Hu, Xiaoshi, Ding, Chao, Wu, Kun, Huang, Yudong
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Published in Acta metallurgica sinica : English letters (01.10.2014)
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Improved Copper Damascene Wires Using Direct Plate on Cobalt Process
Brogan, Lee J, Liu, Yihua, Huie, Matthew M., Reid, Jonathan David, Kelly, James, Shobha, Hosadurga k, Huang, Huai, Motoyama, Koichi, Hu, Chao-kun
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Published in Meeting abstracts (Electrochemical Society) (01.05.2019)
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Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications
Sun, Xiaoxuan, Peethala, Brown, Hopstaken, Marinus, Hu, Chao-kun, Mclaughlin, Paul S, van der Straten, O., Demarest, James, Motoyama, K., Nogami, Takeshi, Lin, Xuan, Zhang, Xunyuan, Kelly, James
Published in Meeting abstracts (Electrochemical Society) (01.09.2017)
Published in Meeting abstracts (Electrochemical Society) (01.09.2017)
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Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect
Nguyen, Son van, Shobha, Hosadurga k, Haigh, Thomas J, Yao, Yiping, Tai, Leo, Cohen, Stephan A, Shaw, Thomas M, Hu, Chao-kun, Liniger, Eric, Virwani, Kumar, Kellock, Andrew J, Canaperi, Donald F
Published in Meeting abstracts (Electrochemical Society) (15.04.2017)
Published in Meeting abstracts (Electrochemical Society) (15.04.2017)
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Highly Robust Advanced Single Precursor Based k 2.4 ILD for Beol Cu Interconnects
Priyadarshini, Deepika, Nguyen, Son van, Shobha, Hosadurga k, Ryan, E. T., Gates, Steven M, Huang, Huai, Chen, James, Liniger, Eric, Cohen, Stephan A, Hu, Chao-kun, Madan, Anita, Adams, Edward, Molis, Steven E, Haigh, Thomas J, Bonilla, Griselda, Standaert, Theodorus, Canaperi, Donald F, Grill, Alfred
Published in Meeting abstracts (Electrochemical Society) (07.07.2015)
Published in Meeting abstracts (Electrochemical Society) (07.07.2015)
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Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects
Nguyen, Son van, Priyadarshini, Deepika, Shobha, Hosadurga k, Haigh, Thomas J, Hu, Chao-kun, Cohen, Stephan A, Liniger, Eric, Shaw, Thomas M, Adams, Edward D, Burnham, Jay, Madan, Anita, Klymko, Nancy R, Parks, Christopher, Yang, Daewon, Molis, Steven E, Lin, Y, Bonilla, Griselda, Grill, Alfred, Edelstein, Daniel, Canaperi, Donald F, Xia, Li-Qun, Reiter, Steven, Balseanu, Mihaela, Shek, Mei-Yee
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
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Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects
Kelly, James, Nogami, Takeshi, Parks, Christopher, Van der Straten, O., Demarest, James, Li, Juntao, DeHaven, Patrick, Hu, Chao-Kun, Liniger, Eric, Penny, Chris, Vo, Tuan
Published in Meeting abstracts (Electrochemical Society) (01.08.2011)
Published in Meeting abstracts (Electrochemical Society) (01.08.2011)
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Enhanced Electromigration in Cu Interconnects Using Upper Level Dummy Vias
Hu, Chao-Kun, Greco, S., McLaughlin, P., Gignac, L., Liniger, E., Demarest, J., Huang, Elbert, Yang, C.
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
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Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices
Nguyen, Son V., Haigh, Thomas, Tagami, Masayoshi, Grill, Alfred, Cohen, Stephan, Shobha, Hosadurga, Hu, Chao-Kun, Adams, Ed, Liniger, Eric, Shaw, Thomas, Cheng, Tien, Yusuff, Hakeem, Xu, Yiheng, Ko, Tze-Man, Molis, Steven, Spooner, Terry, Skordas, Spyridon, Liu, Xiao Hu, Bonilla, Griselda, Edelstein, Dan
Published in Meeting abstracts (Electrochemical Society) (01.08.2011)
Published in Meeting abstracts (Electrochemical Society) (01.08.2011)
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Self-Assembly Based Air-Gap Integration
Ponoth, Shom, Horak, Dave, Nitta, Satya, Colburn, Matthew, Breyta, Greg, Huang, Elbert, Sucharitaves, Jeanne Tania, Landis, Howard, Lisi, Anthony, Liu, Xiao, Vo, Tuan, Johnson, Richard, Li, Wai-kin, Purushothaman, Sampath, Cohen, Stephan, Hu, Chao-Kun, Kim, Ho-Cheol, Clevenger, Larry, Fuller, Nicholas, Nogami, Takeshi, Spooner, Terry, Edelstein, Dan
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
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