Wavelet analysis based deconvolution to improve the resolution of scanning acoustic microscope images for the inspection of thin die layer in semiconductor
Jhang, Kyungyoung, Jang, Hyoseong, Park, Byungil, Ha, Job, Park, Ikkeun, Kim, Kyungsuk
Published in NDT & E international : independent nondestructive testing and evaluation (01.12.2002)
Published in NDT & E international : independent nondestructive testing and evaluation (01.12.2002)
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