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Year of Publication 27.05.2008
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Year of Publication 27.05.2008
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Method of forming an interconnect structure diffusion barrier with high nitrogen content
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Year of Publication 27.05.2008
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Year of Publication 27.05.2008
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EIN VERFAHREN ZUR ABSCHEIDUNG EINER METALLSCHICHT AUF EINER HALBLEITER-INTERKONNEKTSTRUKTUR MIT EINER DECKSCHICHT
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Year of Publication 08.05.2007
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Apparatus and method for flattening a warped substrate
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Year of Publication 08.05.2007
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Year of Publication 08.05.2007
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Interconnect structure diffusion barrier with high nitrogen content
Cabral, Jr, Cyril, Kaldor, Steffen K, Kim, Hyungjun, Rossnagel, Stephen M
Year of Publication 29.08.2006
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Year of Publication 29.08.2006
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Interconnect structure diffusion barrier with high nitrogen content
KIM HYUNGJUN, KALDOR STEFFEN K, ROSSNAGEL STEPHEN M, CABRAL, JR. CYRIL
Year of Publication 29.08.2006
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Year of Publication 29.08.2006
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Apparatus and method for flattening a warped substrate
MURRAY CONAL E, FAYAZ MOHAMMED F, KALDOR STEFFEN K, NOYAN ISMAIL C, PETROSKY ANNE L
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Year of Publication 16.03.2006
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A METHOD FOR DEPOSITING A METAL LAYER ON A SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING A CAPPING LAYER
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Year of Publication 02.06.2010
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Back end interconnect with a shaped interface
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Year of Publication 24.02.2009
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Year of Publication 10.07.2007
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Year of Publication 10.07.2007
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Bilayered metal hardmasks for use in dual damascene etch schemes
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Year of Publication 10.07.2007
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Year of Publication 10.07.2007
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