Electrically conductive adhesive (ECA) for multilayer device interconnects
Das Rabindra N, Lauffer John M, Magnuson Roy H, Chan Benson, Papathomas Konstantinos I, Markovich Voya R
Year of Publication 20.09.2016
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Year of Publication 20.09.2016
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ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERCONNECTS
DAS RABINDRA N, LAUFFER JOHN M, PAPATHOMAS KONSTANTINOS I, MARKOVICH VOYA R, MAGNUSON ROY H, CHAN BENSON
Year of Publication 07.02.2013
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Year of Publication 07.02.2013
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Method of making circuitized substrate with internal optical pathway using photolithography
Chan, Benson, Lin, How T, Magnuson, Roy H, Markovich, Voya R, Poliks, Mark D
Year of Publication 11.05.2010
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Year of Publication 11.05.2010
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Method of making circuitized substrate with internal optical pathway using photolithography
POLIKS MARK D, LIN HOW T, MAGNUSON ROY H, MARKOVICH VOYA R, CHAN BENSON
Year of Publication 11.05.2010
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Year of Publication 11.05.2010
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Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same
Chan, Benson, Egitto, Frank D, Magnuson, Roy H, Markovich, Voya R, Thomas, David L
Year of Publication 16.03.2010
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Year of Publication 16.03.2010
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