Search Results - "Japp, Robert" :: K.UTB vyhledávací portál

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Adaptive filtering to adjust automated selection of content using weightings based on contextual parameters of a browsing session

by Japp Robert Philip
Year of Publication 04.07.2017

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Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers

by PAPATHOMAS KOSTAS, JAPP ROBERT
Year of Publication 21.05.2013

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POWER/GROUND CORE FOR PRINTED CIRCUIT BOARDS, PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THESE BOARDS

by JAPP, ROBERT
Year of Publication 28.06.2006

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POROUS POWER AND GROUND PLANES FOR REDUCED PCB DELAMINATION AND BETTER RELIABILITY

by JAPP ROBERT
Year of Publication 29.07.2002

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Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers

by PAPATHOMAS KOSTAS, JAPP ROBERT
Year of Publication 03.01.2008

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POROUS POWER AND GROUND PLANES FOR REDUCED PCB DELAMINATION AND BETTER RELIABILITY

by JAPP ROBERT, POLIKS MARK
Year of Publication 31.12.2007

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Dielectric composition for forming dielectric layer for use in circuitized substrates

by Japp, Robert, Papathomas, Kostas
Year of Publication 18.09.2007

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Dielectric composition for forming dielectric layer for use in circuitized substrates

by PAPATHOMAS KOSTAS, JAPP ROBERT
Year of Publication 18.09.2007

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Halogen-Free Dielectric Composition For use As Dielectric Layer In Circuitized Substrates

by JAPP ROBERT M, PAPATHOMAS KOSTAS I
Year of Publication 25.08.2011

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ELECTRIC INSULATION STRUCTURE FOR FORMING ELECTRIC INSULATION LAYER TO BE USED FOR CIRCUIT BOARD

by PAPATHOMAS KOSTAS, JAPP ROBERT
Year of Publication 20.10.2005

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Dielectric composition for forming dielectric layer for use in circuitized substrates

by PAPATHOMAS KOSTAS, JAPP ROBERT
Year of Publication 13.10.2005

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Dielectric composition for forming dielectric layer for use in circuitized substrates

by JAPP, ROBERT, PAPATHOMAS, KOSTAS
Year of Publication 05.10.2005

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Method of making halogen-free circuitized substrate with reduced thermal expansion

by JAPP ROBERT M, PAPTHOMAS KOSTAS I, MARKOVICH VOYA R
Year of Publication 06.08.2013

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Porous power and ground planes for reduced PCB delamination and better reliability

by JAPP ROBERT, POLIKS MARK
Year of Publication 17.12.2003

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PORÖSE SPEISUNGS- UND ERDUNGSFLÄCHEN ZUR REDUZIERUNG DER LEITERPLATTEN-DELAMINIERUNG UND VERBESSERUNG DER ZUVERLÄSSIGKEIT

by JAPP, ROBERT, POLIKS, MARK
Year of Publication 27.11.2003

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Power core for use in circuitized substrate and method of making same

by JAPP ROBERT M, KRESGE JOHN STEVEN, PAPATHOMAS KOSTAS, ANTESBERGER TIMOTHY
Year of Publication 12.06.2012

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Power core for use in circuitized substrate and method of making same

by Japp, Robert M, Papathomas, Kostas, Kresge, John Steven, Antesberger, Timothy
Year of Publication 12.06.2012

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Porous power and ground planes for reduced PCB delamination and better reliability

by Poliks, Mark, Japp, Robert
Year of Publication 23.10.2003

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METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES

by JAPP ROBERT M, PAPATHOMAS KOSTAS I, PALOMAKI CHERYL
Year of Publication 19.01.2012

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POROUS POWER AND GROUND PLANES FOR REDUCED PCB DELAMINATION AND BETTER RELIABILITY

by JAPP ROBERT, POLIKS MARK
Year of Publication 24.03.2003

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Patent

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