Search Results - "JOONSEO SON" :: K.UTB vyhledávací portál

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Semiconductor die package including a one-body clip

by Im, Seungwon, Son, Joonseo, Jeon, Oseob
Year of Publication 24.08.2021

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Power module package and method of manufacturing the same

by Lee, Keunhyuk, Im, Seungwon, Son, Joonseo, Jeon, Oseob
Year of Publication 28.03.2023

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Semiconductor package with molded heat sink

by JUNG MAN-KYO, JOONSEO SON
Year of Publication 30.04.2024

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INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

by PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 11.07.2024

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Integrated circuit direct cooling systems having substrates in contact with a cooling medium

by Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 23.04.2024

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Semiconductor die package and manufacturing method

by Im, Seungwon, Jong, Mankyo, Son, Joonseo
Year of Publication 10.03.2020

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POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME RELATED APPLICATION

by LEE, Keunhyuk, JEON, Oseob, IM, Seungwon, SON, Joonseo
Year of Publication 26.08.2021

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Semiconductor package and related methods

by Im, Seungwon, Jong, Mankyo, Jeon, Oseob, Zschieschang, Olaf, Son, JoonSeo
Year of Publication 15.06.2021

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Molded semiconductor package including substrate having beveled edge

by JUNG MAN-KYO, JOONSEO SON
Year of Publication 06.09.2022

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STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MODULES

by Im, Seungwon, Lee, ByoungOk, Jong, Mankyo, Son, Joonseo, Jeon, Oseob
Year of Publication 28.10.2020

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SEMICONDUCTOR DIE PACKAGE INCLUDING A ONE-BODY CLIP

by IM, Seungwon, JEON, Oseob, SON, Joonseo
Year of Publication 18.06.2020

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INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

by PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 24.03.2022

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Semiconductor package having a spacer with a junction cooling pipe

by Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 14.12.2021

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SEMICONDUCTOR PACKAGE AND RELATED METHODS

by ZSCHIESCHANG, Olaf, JONG, Mankyo, SON, JoonSeo, IM, Seungwon, JEON, Oseob
Year of Publication 26.08.2021

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Semiconductor package and related methods

by Im, Seungwon, Jong, Mankyo, Jeon, Oseob, Zschieschang, Olaf, Son, JoonSeo
Year of Publication 03.09.2019

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STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MODULES

by MANKYO JONG, SEUNGWON IM, OSEOB JEON, BYOUNGOK LEE, JOONSEO SON
Year of Publication 19.05.2021

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Stray inductance reduction in packaged semiconductor devices and modules

by Im, Seungwon, Lee, ByoungOk, Jong, Mankyo, Son, Joonseo, Jeon, Oseob
Year of Publication 02.10.2018

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STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MODULES

by Im, Seungwon, Lee, ByoungOk, Jong, Mankyo, Son, Joonseo, Jeon, Oseob
Year of Publication 05.09.2018

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INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

by PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 11.06.2020

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Semiconductor package having junction cooling pipes embedded in substrates

by Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 31.03.2020

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