Electromigration Failure Time Model of General Circuit-Like Interconnects
Ming-Hsien Lin, Oates, Tony
Published in IEEE transactions on device and materials reliability (01.06.2017)
Published in IEEE transactions on device and materials reliability (01.06.2017)
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Magazine Article
A 16nm All-Digital Hardware Monitor for Evaluating Electromigration Effects in Signal Interconnects Through Bit-Error-Rate Tracking
Pande, Nakul, Zhou, Chen, Lin, Ming-Hsien, Fung, Rita, Wong, Richard, Wen, Shi-Jie, Kim, Chris H.
Published in IEEE transactions on device and materials reliability (01.06.2022)
Published in IEEE transactions on device and materials reliability (01.06.2022)
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