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Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multimodal Failure Distribution
by
Seung
-
Hyun Chae
,
Jie-Hua Zhao
,
Edwards, D.R.
,
Ho, P.S.
Published in
IEEE transactions on device and materials reliability
(01.03.2010)
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engineering
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physics
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ball on ring
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blades
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deconvolution
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defects
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dicing
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die strength
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