Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
KORHONEN, Tia-Marje K, TURPEINEN, Pekka, LEHMAN, Lawrence P, BOWMAN, Brian, THIEL, George H, PARKES, Raymond C, KORHONEN, Matt A, HENDERSON, Donald W, PUTTLITZ, Karl J
Published in Journal of electronic materials (01.12.2004)
Published in Journal of electronic materials (01.12.2004)
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