Effect of Molecular Weight of Surfactant in Nano Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing (CMP)
Kang, Hyun-Goo, Katoh, Takeo, Lee, Myung-Yoon, Park, Hyung-Soon, Paik, Ungyu, Park, Jea-Gun
Published in Japanese Journal of Applied Physics (15.08.2004)
Published in Japanese Journal of Applied Physics (15.08.2004)
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Journal Article
Dependence of pH, Molecular Weight, and Concentration of Surfactant in Ceria Slurry on Saturated Nitride Removal Rate in Shallow Trench Isolation Chemical Mechanical Polishing
Kang, Hyun-Goo, Lee, Myung-Yoon, Park, Hyung-Soon, Paik, Ungyu, Park, Jea-Gun
Published in Japanese Journal of Applied Physics (01.07.2005)
Published in Japanese Journal of Applied Physics (01.07.2005)
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Journal Article