Copper Electrodeposition on Thin-Seed Substrates
Hafezi, Hooman, Rosenfeld, Aron, Singh, Saravjeet, Dukovic, John, Birang, Manush
Published in Meeting abstracts (Electrochemical Society) (22.02.2006)
Published in Meeting abstracts (Electrochemical Society) (22.02.2006)
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Morphology of Electrodeposited Cu on 300 mm PEALD Ru Substrates
Kelly, James, Vo, Tuan, Van der Straten, O., Huang, Qiang, Baker O'Neal, Brett, Shao, X I., Chiang, Sunny, Dukovic, John
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
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Journal Article