Ceramic packages for liquid-nitrogen operation
Tong, H.-M., Yeh, H.L., Goldblatt, R.D., Srivastava, K.K., Coffin, J.T., Rosenberg, W.D., Jaspal, J.S.
Published in IEEE transactions on electron devices (01.08.1989)
Published in IEEE transactions on electron devices (01.08.1989)
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Journal Article
Effects of parylene coating on the thermal fatigue life of solder joints in ceramic packages
Tong, H.-M., Mok, L.S., Grebe, K.R., Yeh, H.L., Srivastava, K.K., Coffin, J.T.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.08.1993)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.08.1993)
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